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SN74LVTH16541DGG

SN74LVTH16541DGG

Manufacturer No:

SN74LVTH16541DGG

Manufacturer:

Texas Instruments

Description:

IC BUFF NON-INVERT 3.6V 48TSSOP

Datasheet:

Datasheet

Delivery:

Payment:

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SN74LVTH16541DGG Specifications

  • Type
    Parameter
  • Supplier Device Package
    48-TSSOP
  • Package / Case
    48-TFSOP (0.240", 6.10mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C (TA)
  • Voltage - Supply
    2.7V ~ 3.6V
  • Current - Output High, Low
    32mA, 64mA
  • Output Type
    3-State
  • Input Type
    -
  • Number of Bits per Element
    8
  • Number of Elements
    2
  • Logic Type
    Buffer, Non-Inverting
  • Packaging
    Bulk
  • Product Status
    Active
  • Series
    74LVTH
The MB90022PF-GS-115-BND is a specific model of integrated circuit (IC) chip manufactured by Fujitsu. While specific advantages and application scenarios may vary depending on the specific requirements and use cases, here are some general advantages and potential application scenarios for this IC chip:Advantages: 1. Low Power Consumption: The MB90022PF-GS-115-BND is designed to operate with low power consumption, making it suitable for battery-powered devices or applications where power efficiency is crucial. 2. High Performance: This IC chip offers high processing power and performance, enabling it to handle complex tasks and calculations efficiently. 3. Compact Size: The chip's small form factor allows for easy integration into various electronic devices, making it suitable for space-constrained applications. 4. Versatility: The MB90022PF-GS-115-BND supports a wide range of peripherals and interfaces, providing flexibility in connecting and communicating with other components or devices. 5. Cost-Effective: Fujitsu IC chips are known for their cost-effectiveness, making them suitable for mass production and commercial applications.Application Scenarios: 1. Internet of Things (IoT) Devices: The low power consumption and compact size of the MB90022PF-GS-115-BND make it suitable for IoT devices, such as smart home appliances, wearable devices, or sensor nodes. 2. Industrial Automation: The high performance and versatility of this IC chip make it suitable for industrial automation applications, including robotics, control systems, or monitoring devices. 3. Consumer Electronics: The chip's low power consumption and compact size make it suitable for various consumer electronics, such as smartphones, tablets, or portable media players. 4. Automotive Electronics: The MB90022PF-GS-115-BND can be used in automotive applications, including engine control units, infotainment systems, or advanced driver-assistance systems (ADAS). 5. Medical Devices: The chip's low power consumption and high performance make it suitable for medical devices, such as patient monitoring systems, diagnostic equipment, or portable medical devices.It's important to note that the specific advantages and application scenarios may vary depending on the requirements and specifications of the project or product. It is recommended to consult the datasheet and technical documentation provided by Fujitsu for detailed information on the capabilities and recommended applications of the MB90022PF-GS-115-BND IC chip.
SN74LVTH16541DGG Relevant information