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74AC11244DW

74AC11244DW

Manufacturer No:

74AC11244DW

Manufacturer:

Texas Instruments

Description:

IC BUF NON-INVERT 5.5V 24SOIC

Datasheet:

Datasheet

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74AC11244DW Specifications

  • Type
    Parameter
  • Supplier Device Package
    24-SOIC
  • Package / Case
    24-SOIC (0.295", 7.50mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C (TA)
  • Voltage - Supply
    3V ~ 5.5V
  • Current - Output High, Low
    24mA, 24mA
  • Output Type
    3-State
  • Input Type
    -
  • Number of Bits per Element
    4
  • Number of Elements
    2
  • Logic Type
    Buffer, Non-Inverting
  • Packaging
    Tube
  • Packaging
    Bulk
  • Product Status
    Last Time Buy
  • Series
    74AC
The MB89697BPFM-G-200-BND integrated circuit chips have several advantages and application scenarios:Advantages: 1. High Performance: The chips are designed with a high-performance 16-bit microcontroller core, which enables fast and efficient processing of instructions. 2. Low Power Consumption: The chips are optimized for low power consumption, making them suitable for battery-powered devices or applications where power efficiency is crucial. 3. Rich Peripherals: The chips come with a wide range of built-in peripherals such as UART, I2C, SPI, timers, and ADC, which provide flexibility and ease of integration into various applications. 4. Enhanced Security: The chips offer security features like a hardware encryption engine and memory protection unit, ensuring data integrity and protection against unauthorized access. 5. Extended Temperature Range: The chips are designed to operate reliably in a wide temperature range, making them suitable for applications in harsh environments.Application Scenarios: 1. Industrial Automation: The chips can be used in industrial automation systems for controlling and monitoring processes, thanks to their high performance, low power consumption, and robustness. 2. Automotive Electronics: The chips are suitable for automotive applications such as engine control units, dashboard systems, and body control modules, where reliability, security, and temperature tolerance are essential. 3. Consumer Electronics: The chips can be used in various consumer electronic devices like home appliances, gaming consoles, and smart devices, where low power consumption and high performance are desired. 4. Internet of Things (IoT): The chips can be utilized in IoT devices for data processing, connectivity, and control, enabling efficient and secure communication between devices. 5. Medical Devices: The chips can be employed in medical devices like patient monitoring systems, portable medical instruments, and implantable devices, where reliability, low power consumption, and security are critical factors.Overall, the MB89697BPFM-G-200-BND integrated circuit chips offer a combination of high performance, low power consumption, security features, and temperature tolerance, making them suitable for a wide range of applications in various industries.
74AC11244DW Relevant information