74FCT163827APAG
Manufacturer No:
74FCT163827APAG
Manufacturer:
Description:
IC BUFF NON-INVERT 3.6V 56TSSOP
Datasheet:
Delivery:
Payment:
In Stock : 5270
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74FCT163827APAG Specifications
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TypeParameter
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Supplier Device Package56-TSSOP
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Package / Case56-TFSOP (0.240", 6.10mm Width)
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Mounting TypeSurface Mount
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Operating Temperature-40°C ~ 85°C (TA)
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Voltage - Supply2.7V ~ 3.6V
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Current - Output High, Low8mA, 24mA
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Output Type3-State
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Input Type-
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Number of Bits per Element10
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Number of Elements2
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Logic TypeBuffer, Non-Inverting
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PackagingBulk
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Product StatusActive
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Series74FCT
The CY96F356RSBPMC-GS-UJERE2 integrated circuit (IC) chips have several advantages and can be applied to various scenarios. Some of the advantages and application scenarios are as follows:Advantages: 1. High-performance: These IC chips are designed with advanced technology, providing high-speed and efficient processing capabilities. 2. Low power consumption: They are optimized for low power consumption, making them suitable for battery-operated devices or energy-efficient applications. 3. Embedded memory: The IC chips have embedded flash memory, which allows for storing program code or data directly on the chip. 4. Enhanced security: They provide security features like data encryption and secure boot, making them suitable for applications requiring data protection. 5. Rich interface options: The IC chips offer various communication interfaces such as UART, SPI, I2C, USB, etc., enabling seamless integration with other devices.Application scenarios: 1. Internet of Things (IoT): These IC chips can be used in IoT devices for smart homes, smart cities, industrial automation, etc., due to their low power consumption, embedded memory, and communication interfaces. 2. Automation systems: They can be employed in control systems, industrial machines, and robotic applications, providing high-speed processing and reliable communication capabilities. 3. Consumer electronics: The IC chips can be utilized in products like smartwatches, fitness trackers, wearables, and other portable devices due to their low power consumption and embedded memory. 4. Automotive electronics: They can be employed in automotive applications such as engine control units (ECUs), advanced driver-assistance systems (ADAS), and infotainment systems due to their high-performance processing and security features. 5. Security systems: These IC chips can be used in access control systems, surveillance cameras, or alarm systems, leveraging their secure boot and data encryption features for enhanced security.It is important to note that the specific advantages and application scenarios may vary depending on the requirements and specifications of the individual product.
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