Home / Buffers, Drivers, Receivers, Transceivers / 74AVC20T245DGG,118/
74AVC20T245DGG,118

74AVC20T245DGG,118

Manufacturer No:

74AVC20T245DGG,118

Manufacturer:

Nexperia USA Inc.

Description:

IC TRANSLATOR BIDIR 56TSSOP

Datasheet:

Datasheet

Delivery:

Payment:

Please send RFQ , we will respond immediately.

74AVC20T245DGG,118 Specifications

  • Type
    Parameter
  • Supplier Device Package
    56-TSSOP
  • Package / Case
    56-TFSOP (0.240", 6.10mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 125°C (TA)
  • Voltage - Supply
    0.8V ~ 3.6V
  • Current - Output High, Low
    12mA, 12mA
  • Output Type
    3-State
  • Input Type
    -
  • Number of Bits per Element
    10
  • Number of Elements
    2
  • Logic Type
    Translation Transceiver
  • Packaging
    Cut Tape (CT)
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Active
  • Series
    74AVC
The SY10EPT23LKG is a specific type of integrated circuit chip that falls under the ECLinPS family of logic devices by Microchip Technology. Although exact information about this specific chip is not readily available, we can generalize the advantages and potential application scenarios for ECLinPS integrated circuit chips like the SY10EPT23LKG:Advantages: 1. High-Speed Performance: ECLinPS chips are known for their high-speed operation, typically in the range of hundreds of megahertz to several gigahertz. These devices are designed for applications that require high-frequency signal processing and fast data transmission.2. Low Power Consumption: ECLinPS chips use emitter-coupled logic (ECL) technology, which typically consumes less power compared to other logic families like CMOS. This makes them suitable for applications where power efficiency is a concern.3. Noise Immunity: ECLinPS chips have good noise immunity, making them less susceptible to external electrical noise and glitches. This makes them reliable for high-speed data communication in noisy environments.4. Differential Signaling: ECLinPS devices utilize differential signaling, where data transmission occurs over a pair of complementary signals that significantly reduce the effects of common-mode noise and enhance data integrity. This improves signal integrity and reduces errors.Application Scenarios: 1. High-Speed Communications: ECLinPS chips find applications in high-speed data communication systems, such as fiber optic networks, high-speed serial links, and telecommunication equipment. Their ability to handle high-frequency signals and low jitter makes them suitable for these scenarios.2. Test and Measurement Equipment: Due to their high-speed performance, ECLinPS chips are utilized in various test and measurement instruments like oscilloscopes, spectrum analyzers, and logic analyzers. These devices require precise timing and high-speed data processing.3. Radar and Defense Systems: ECLinPS chips are commonly used in radar systems due to their high frequency and low noise characteristics. These chips can handle the high-speed data processing requirements of radar systems used in areas such as military defense and air traffic control.4. High-Performance Computing: ECLinPS chips are used in high-performance computing applications that demand fast data transmission and low latency. Examples include supercomputers, high-frequency trading systems, and scientific research applications.It's important to note that while these are generalized advantages and applications for ECLinPS chips, specific details about the SY10EPT23LKG may not be covered here. For precise information about this chip, it's recommended to refer to the official datasheet or contact Microchip Technology directly.
74AVC20T245DGG,118 Relevant information