SN74ALS541DBR

SN74ALS541DBR

Manufacturer No:

SN74ALS541DBR

Manufacturer:

Texas Instruments

Description:

IC BUF NON-INVERT 5.5V 20SSOP

Datasheet:

Datasheet

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SN74ALS541DBR Specifications

  • Type
    Parameter
  • Supplier Device Package
    20-SSOP
  • Package / Case
    20-SSOP (0.209", 5.30mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    0°C ~ 70°C (TA)
  • Voltage - Supply
    4.5V ~ 5.5V
  • Current - Output High, Low
    15mA, 24mA
  • Output Type
    3-State
  • Input Type
    -
  • Number of Bits per Element
    8
  • Number of Elements
    1
  • Logic Type
    Buffer, Non-Inverting
  • Packaging
    Cut Tape (CT)
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Active
  • Series
    74ALS
The S6E2HG6F0AGV20000 integrated circuit (IC) chips, developed by Renesas Electronics, offer several advantages and can be applied in various scenarios. Some of the advantages and application scenarios of these chips are:Advantages: 1. High Performance: The S6E2HG6F0AGV20000 chips are based on the ARM Cortex-M4F core, which provides high processing power and performance for demanding applications. 2. Low Power Consumption: These chips are designed to be energy-efficient, making them suitable for battery-powered devices or applications where power consumption is a concern. 3. Rich Peripherals: The IC chips offer a wide range of integrated peripherals, including multiple UART, SPI, I2C, and CAN interfaces, which enable seamless connectivity with other devices. 4. Enhanced Security: The chips come with built-in security features like a hardware encryption engine, secure boot, and tamper detection, ensuring data integrity and protection against unauthorized access. 5. Ample Memory: With a large flash memory capacity and RAM, these chips can handle complex applications and store significant amounts of data.Application Scenarios: 1. Industrial Automation: The S6E2HG6F0AGV20000 chips are suitable for industrial automation applications, such as programmable logic controllers (PLCs), motor control systems, and robotics, due to their high performance, connectivity options, and robustness. 2. Internet of Things (IoT): These chips can be used in IoT devices, including smart home automation systems, wearable devices, and sensor nodes, thanks to their low power consumption, integrated peripherals, and security features. 3. Automotive Electronics: The IC chips find applications in automotive electronics, such as advanced driver-assistance systems (ADAS), infotainment systems, and engine control units (ECUs), due to their high processing power, connectivity, and security capabilities. 4. Consumer Electronics: The chips can be utilized in various consumer electronic devices, including smart appliances, gaming consoles, and multimedia systems, benefiting from their performance, memory capacity, and connectivity options. 5. Medical Devices: These chips can be employed in medical devices like patient monitoring systems, diagnostic equipment, and implantable devices, leveraging their processing power, security features, and low power consumption.Overall, the S6E2HG6F0AGV20000 IC chips offer a combination of high performance, low power consumption, rich peripherals, and security features, making them suitable for a wide range of applications in different industries.