Home / Buffers, Drivers, Receivers, Transceivers / CY74FCT16827ETPACT/
CY74FCT16827ETPACT

CY74FCT16827ETPACT

Manufacturer No:

CY74FCT16827ETPACT

Manufacturer:

Texas Instruments

Description:

IC BUFF NON-INVERT 5.5V 56TSSOP

Datasheet:

Datasheet

Delivery:

Payment:

Please send RFQ , we will respond immediately.

CY74FCT16827ETPACT Specifications

  • Type
    Parameter
  • Supplier Device Package
    56-TSSOP
  • Package / Case
    56-TFSOP (0.240", 6.10mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C (TA)
  • Voltage - Supply
    4.5V ~ 5.5V
  • Current - Output High, Low
    15mA, 64mA
  • Output Type
    3-State
  • Input Type
    -
  • Number of Bits per Element
    10
  • Number of Elements
    2
  • Logic Type
    Buffer, Non-Inverting
  • Packaging
    Bulk
  • Product Status
    Active
  • Series
    -
The MB89663PF-GT-169-BND integrated circuit chips have several advantages and application scenarios:Advantages: 1. High Performance: These chips are based on the 16-bit CISC architecture and offer high processing power and performance. 2. Low Power Consumption: They are designed to operate at low power, making them suitable for battery-powered devices and energy-efficient applications. 3. Integrated Peripherals: The chips come with various integrated peripherals such as UART, I2C, SPI, timers, and PWM, reducing the need for external components. 4. Rich Memory Options: They offer a range of memory options, including Flash memory, SRAM, and EEPROM, providing flexibility for different application requirements. 5. Enhanced Security: These chips come with built-in security features like a hardware random number generator and memory protection unit, ensuring data integrity and system security.Application Scenarios: 1. Industrial Automation: The MB89663PF-GT-169-BND chips can be used in industrial automation systems for controlling and monitoring processes, thanks to their high performance and integrated peripherals. 2. Consumer Electronics: They are suitable for various consumer electronic devices like smart home appliances, wearable devices, and gaming consoles, where low power consumption and high processing power are essential. 3. Automotive Electronics: These chips can be used in automotive applications such as engine control units, dashboard systems, and infotainment systems, where reliability, performance, and security are critical. 4. Internet of Things (IoT): With their low power consumption and integrated peripherals, these chips are ideal for IoT devices like smart sensors, smart meters, and connected devices that require efficient processing and connectivity. 5. Medical Devices: The chips can be used in medical devices like patient monitoring systems, portable medical devices, and diagnostic equipment, where high performance, low power consumption, and data security are crucial.Overall, the MB89663PF-GT-169-BND integrated circuit chips offer a combination of performance, power efficiency, and integrated peripherals, making them suitable for a wide range of applications in various industries.
CY74FCT16827ETPACT Relevant information