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CY74FCT162827ETPAC

CY74FCT162827ETPAC

Manufacturer No:

CY74FCT162827ETPAC

Manufacturer:

Texas Instruments

Description:

IC BUFF NON-INVERT 5.5V 56TSSOP

Datasheet:

Datasheet

Delivery:

Payment:

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CY74FCT162827ETPAC Specifications

  • Type
    Parameter
  • Supplier Device Package
    56-TSSOP
  • Package / Case
    56-TFSOP (0.240", 6.10mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C (TA)
  • Voltage - Supply
    4.5V ~ 5.5V
  • Current - Output High, Low
    24mA, 24mA
  • Output Type
    3-State
  • Input Type
    -
  • Number of Bits per Element
    10
  • Number of Elements
    2
  • Logic Type
    Buffer, Non-Inverting
  • Packaging
    Bulk
  • Product Status
    Active
  • Series
    -
The MB89637RPFR-G-1376-BND integrated circuit chips, also known as Fujitsu's 16-bit microcontroller chips, have several advantages and application scenarios:Advantages: 1. High Performance: These chips offer high processing power and performance due to their 16-bit architecture, making them suitable for demanding applications. 2. Integrated Peripherals: They come with a wide range of integrated peripherals such as timers, UART, I2C, SPI, ADC, and PWM, reducing the need for external components and simplifying the design process. 3. Low Power Consumption: These chips are designed to operate efficiently with low power consumption, making them suitable for battery-powered devices or applications where power efficiency is crucial. 4. Enhanced Security: They provide security features like memory protection, code encryption, and tamper detection, ensuring the safety and integrity of the system. 5. Ample Memory: These chips offer a significant amount of on-chip memory, including Flash memory for program storage and RAM for data storage, allowing for complex applications and data manipulation.Application Scenarios: 1. Industrial Automation: The high performance and integrated peripherals make these chips suitable for industrial automation applications such as motor control, robotics, and process control systems. 2. Consumer Electronics: These chips can be used in various consumer electronic devices like home appliances, gaming consoles, audio/video equipment, and smart devices due to their processing power and low power consumption. 3. Automotive Systems: With their robustness, security features, and integrated peripherals, these chips find applications in automotive systems like engine control units (ECUs), dashboard displays, and advanced driver-assistance systems (ADAS). 4. Internet of Things (IoT): The low power consumption and integrated peripherals make these chips ideal for IoT devices such as smart meters, wearable devices, home automation systems, and environmental monitoring systems. 5. Medical Devices: The high performance, security features, and ample memory make these chips suitable for medical devices like patient monitoring systems, diagnostic equipment, and implantable devices.Overall, the MB89637RPFR-G-1376-BND integrated circuit chips offer a combination of performance, power efficiency, integrated peripherals, and security features, making them versatile for a wide range of applications in various industries.
CY74FCT162827ETPAC Relevant information