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CY74FCT16827ETPAC

CY74FCT16827ETPAC

Manufacturer No:

CY74FCT16827ETPAC

Manufacturer:

Texas Instruments

Description:

IC BUFF NON-INVERT 5.5V 56TSSOP

Datasheet:

Datasheet

Delivery:

Payment:

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CY74FCT16827ETPAC Specifications

  • Type
    Parameter
  • Supplier Device Package
    56-TSSOP
  • Package / Case
    56-TFSOP (0.240", 6.10mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C (TA)
  • Voltage - Supply
    4.5V ~ 5.5V
  • Current - Output High, Low
    15mA, 64mA
  • Output Type
    3-State
  • Input Type
    -
  • Number of Bits per Element
    10
  • Number of Elements
    2
  • Logic Type
    Buffer, Non-Inverting
  • Packaging
    Tube
  • Product Status
    Active
  • Series
    -
The MB89637RPF-G-620-BNDE1 is a specific model of integrated circuit chip manufactured by Fujitsu. While specific advantages and application scenarios may vary depending on the specific requirements and use cases, here are some general advantages and potential application scenarios for this chip:Advantages: 1. High Performance: The MB89637RPF-G-620-BNDE1 chip is designed to deliver high performance with a 16-bit microcontroller core running at a clock speed of up to 20 MHz. This makes it suitable for applications that require fast processing and real-time control.2. Rich Peripheral Set: The chip offers a rich set of peripherals, including UART, I2C, SPI, timers, PWM, ADC, and more. This allows for easy integration with various external devices and sensors, making it suitable for applications that require communication, data acquisition, and control.3. Low Power Consumption: The chip is designed to operate at low power, making it suitable for battery-powered or energy-efficient applications. It includes power-saving modes and features that help optimize power consumption.4. Ample Memory: The chip provides a significant amount of on-chip memory, including flash memory for program storage and RAM for data storage. This allows for the implementation of complex algorithms and data processing tasks.Application Scenarios: 1. Industrial Automation: The high performance and rich peripheral set of the MB89637RPF-G-620-BNDE1 chip make it suitable for industrial automation applications. It can be used for controlling and monitoring various processes, interfacing with sensors and actuators, and implementing communication protocols.2. Consumer Electronics: The chip's low power consumption and ample memory make it suitable for consumer electronics applications. It can be used in devices such as smart home controllers, IoT devices, remote controls, and wearable devices.3. Automotive Systems: The chip's robustness, real-time control capabilities, and communication features make it suitable for automotive applications. It can be used in systems such as engine control units, dashboard controllers, and advanced driver-assistance systems (ADAS).4. Medical Devices: The chip's high performance and rich peripheral set make it suitable for medical device applications. It can be used in devices such as patient monitoring systems, medical imaging equipment, and diagnostic devices.It's important to note that the specific advantages and application scenarios may vary depending on the requirements and specifications of the project. It is recommended to consult the datasheet and technical documentation provided by the manufacturer for detailed information and to ensure suitability for a specific application.
CY74FCT16827ETPAC Relevant information