SN74LVC125AMDREP

SN74LVC125AMDREP

Manufacturer No:

SN74LVC125AMDREP

Manufacturer:

Texas Instruments

Description:

IC BUF NON-INVERT 3.6V 14SOIC

Datasheet:

Datasheet

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SN74LVC125AMDREP Specifications

  • Type
    Parameter
  • Supplier Device Package
    14-SOIC
  • Package / Case
    14-SOIC (0.154", 3.90mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -55°C ~ 125°C (TA)
  • Voltage - Supply
    1.65V ~ 3.6V
  • Current - Output High, Low
    24mA, 24mA
  • Output Type
    3-State
  • Input Type
    -
  • Number of Bits per Element
    1
  • Number of Elements
    4
  • Logic Type
    Buffer, Non-Inverting
  • Packaging
    Cut Tape (CT)
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Active
  • Series
    74LVC
The DSPIC33FJ128GP710A-E/PF is a high-performance, 16-bit digital signal controller (DSC) chip manufactured by Microchip Technology. It offers several advantages and can be applied in various scenarios, including:1. High-performance processing: The DSPIC33FJ128GP710A-E/PF chip is designed to provide high-performance processing capabilities, making it suitable for applications that require real-time signal processing, such as motor control, power conversion, and audio processing.2. Integrated peripherals: The chip includes a wide range of integrated peripherals, including analog-to-digital converters (ADCs), digital-to-analog converters (DACs), timers, UARTs, SPI, I2C, and more. This integration simplifies the design process and reduces the need for external components, making it ideal for applications with space and cost constraints.3. Enhanced connectivity: The chip supports various communication protocols, including CAN, USB, Ethernet, and LIN, enabling seamless connectivity with other devices and systems. This makes it suitable for applications that require communication and networking capabilities, such as industrial automation, automotive systems, and IoT devices.4. Low power consumption: The DSPIC33FJ128GP710A-E/PF chip incorporates power-saving features, such as multiple power-saving modes and low-power peripherals. This makes it suitable for battery-powered applications or devices that require energy efficiency.5. Robust and reliable: The chip is designed to operate in harsh environments, with features like high-temperature operation, ESD protection, and robust peripherals. This makes it suitable for applications in automotive, industrial, and aerospace sectors, where reliability is crucial.Application scenarios for the DSPIC33FJ128GP710A-E/PF chip include:1. Motor control: The chip's high-performance processing capabilities and integrated peripherals make it suitable for motor control applications, such as robotics, industrial automation, and electric vehicles.2. Power conversion: The chip's analog and digital peripherals, along with its real-time processing capabilities, make it suitable for power conversion applications, such as inverters, power supplies, and renewable energy systems.3. Audio processing: The chip's high-performance DSP capabilities and integrated peripherals make it suitable for audio processing applications, such as audio effects processors, digital mixers, and audio amplifiers.4. Industrial automation: The chip's connectivity options, real-time processing capabilities, and robustness make it suitable for various industrial automation applications, such as PLCs (Programmable Logic Controllers), motor control systems, and process control systems.5. Automotive systems: The chip's robustness, communication capabilities, and real-time processing make it suitable for automotive applications, such as engine control units, body control modules, and infotainment systems.Overall, the DSPIC33FJ128GP710A-E/PF chip offers high-performance processing, integrated peripherals, connectivity options, low power consumption, and robustness, making it suitable for a wide range of applications in various industries.