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CD74FCT827CTM

CD74FCT827CTM

Manufacturer No:

CD74FCT827CTM

Manufacturer:

Harris Corporation

Description:

IC BUFF NON-INVERT 5.25V 24SOIC

Datasheet:

Datasheet

Delivery:

Payment:

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CD74FCT827CTM Specifications

  • Type
    Parameter
  • Supplier Device Package
    24-SOIC
  • Package / Case
    24-SOIC (0.295", 7.50mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C (TA)
  • Voltage - Supply
    4.75V ~ 5.25V
  • Current - Output High, Low
    15mA, 48mA
  • Output Type
    3-State
  • Input Type
    -
  • Number of Bits per Element
    10
  • Number of Elements
    1
  • Logic Type
    Buffer, Non-Inverting
  • Packaging
    Bulk
  • Product Status
    Active
  • Series
    -
The MB89925PF-G-166-BND is a specific model of integrated circuit (IC) chip manufactured by Fujitsu. While specific advantages and application scenarios may vary depending on the specific requirements and use cases, here are some general advantages and potential application scenarios for this IC chip:Advantages: 1. High Performance: The MB89925PF-G-166-BND is designed to deliver high performance with its advanced architecture and optimized circuitry. 2. Low Power Consumption: This IC chip is designed to operate efficiently with low power consumption, making it suitable for battery-powered devices or energy-efficient applications. 3. Integrated Features: It offers a range of integrated features, such as a microcontroller unit (MCU), memory, peripherals, and interfaces, reducing the need for external components and simplifying the overall system design. 4. Small Form Factor: The compact size of the chip enables it to be easily integrated into space-constrained applications. 5. Cost-Effective: The integration of multiple functionalities into a single chip can help reduce overall system costs.Application Scenarios: 1. Internet of Things (IoT) Devices: The MB89925PF-G-166-BND can be used in various IoT applications, such as smart home devices, wearable technology, industrial automation, and environmental monitoring systems. 2. Consumer Electronics: It can be utilized in consumer electronics products like smart appliances, remote controls, gaming consoles, and multimedia devices. 3. Industrial Control Systems: The chip's high performance and integrated features make it suitable for industrial control systems, including factory automation, robotics, and process control. 4. Automotive Electronics: It can be employed in automotive applications, such as engine control units (ECUs), dashboard displays, infotainment systems, and advanced driver-assistance systems (ADAS). 5. Medical Devices: The chip's low power consumption and integrated features make it suitable for medical devices like patient monitoring systems, portable diagnostic devices, and medical imaging equipment.It is important to note that the specific advantages and application scenarios may vary depending on the requirements and specifications of the target application. It is recommended to consult the datasheet and technical documentation provided by the manufacturer for detailed information and suitability for specific use cases.
CD74FCT827CTM Relevant information