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74LVT16543ADGGS

74LVT16543ADGGS

Manufacturer No:

74LVT16543ADGGS

Manufacturer:

Nexperia USA Inc.

Description:

IC TXRX NON-INVERT 3.6V 56TSSOP

Datasheet:

Datasheet

Delivery:

Payment:

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74LVT16543ADGGS Specifications

  • Type
    Parameter
  • Supplier Device Package
    56-TSSOP
  • Package / Case
    56-TFSOP (0.240", 6.10mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C (TA)
  • Voltage - Supply
    2.7V ~ 3.6V
  • Current - Output High, Low
    32mA, 64mA
  • Output Type
    3-State
  • Input Type
    -
  • Number of Bits per Element
    16
  • Number of Elements
    1
  • Logic Type
    Transceiver, Non-Inverting
  • Packaging
    Bulk
  • Product Status
    Active
  • Series
    74LVT
The SPC560P60L3BEABR integrated circuit chips have several advantages and application scenarios:Advantages: 1. High Performance: The SPC560P60L3BEABR chips are based on the Power Architecture? technology, offering high processing power and performance. 2. Enhanced Security: These chips come with advanced security features like secure boot, memory protection, and cryptographic accelerators, ensuring the safety of the system. 3. Connectivity: The chips support various communication interfaces like CAN, LIN, FlexRay, and Ethernet, enabling seamless connectivity with other devices. 4. Automotive Grade: The SPC560P60L3BEABR chips are designed specifically for automotive applications, meeting the stringent requirements of the automotive industry. 5. Robustness: These chips are built to withstand harsh automotive environments, with features like high-temperature operation, EMI/EMC protection, and robust packaging.Application Scenarios: 1. Automotive Control Systems: The SPC560P60L3BEABR chips are commonly used in automotive control systems like engine management, transmission control, chassis control, and body electronics. 2. Advanced Driver Assistance Systems (ADAS): These chips can be utilized in ADAS applications such as adaptive cruise control, lane departure warning, blind-spot detection, and collision avoidance systems. 3. Infotainment Systems: The SPC560P60L3BEABR chips can be employed in infotainment systems to provide multimedia capabilities, connectivity options, and user interface control. 4. Telematics: These chips can be used in telematics applications for vehicle tracking, remote diagnostics, fleet management, and over-the-air updates. 5. Industrial Automation: The high-performance and robustness of these chips make them suitable for industrial automation applications like robotics, machine control, and process monitoring.Overall, the SPC560P60L3BEABR integrated circuit chips offer a combination of high performance, security, and automotive-grade features, making them ideal for various automotive and industrial applications.
74LVT16543ADGGS Relevant information