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SN74LV07APWT

SN74LV07APWT

Manufacturer No:

SN74LV07APWT

Manufacturer:

Texas Instruments

Description:

IC BUF NON-INVERT 5.5V 14TSSOP

Datasheet:

Datasheet

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SN74LV07APWT Specifications

  • Type
    Parameter
  • Supplier Device Package
    14-TSSOP
  • Package / Case
    14-TSSOP (0.173", 4.40mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 125°C (TA)
  • Voltage - Supply
    2V ~ 5.5V
  • Current - Output High, Low
    -, 16mA
  • Output Type
    Open Drain
  • Input Type
    -
  • Number of Bits per Element
    1
  • Number of Elements
    6
  • Logic Type
    Buffer, Non-Inverting
  • Packaging
    Cut Tape (CT)
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Discontinued at Digi-Key
  • Series
    74LV
The SIM3C144-B-GMR is an integrated circuit chip developed by Silicon Labs. It is a highly integrated, low-power, and cost-effective solution for wireless communication applications. Some of the advantages and application scenarios of this chip are:1. Low Power Consumption: The SIM3C144-B-GMR chip is designed to operate with minimal power consumption, making it suitable for battery-powered devices and energy-efficient applications.2. High Integration: This chip integrates various components required for wireless communication, including a transceiver, microcontroller, and memory, reducing the need for external components and simplifying the design process.3. Cost-Effective Solution: The integration of multiple functionalities into a single chip reduces the overall system cost, making it an economical choice for wireless communication applications.4. Wireless Connectivity: The SIM3C144-B-GMR chip supports various wireless communication protocols, such as Bluetooth Low Energy (BLE) and Zigbee, enabling seamless connectivity with other devices and networks.5. IoT Applications: This chip is well-suited for Internet of Things (IoT) applications, where low-power wireless communication is essential for connecting and controlling a large number of devices.6. Home Automation: The SIM3C144-B-GMR chip can be used in home automation systems to enable wireless control and monitoring of various devices, such as lights, thermostats, and security systems.7. Wearable Devices: Due to its low power consumption and small form factor, this chip can be integrated into wearable devices like fitness trackers, smartwatches, and healthcare monitoring devices.8. Industrial Automation: The SIM3C144-B-GMR chip can be utilized in industrial automation systems for wireless communication between sensors, actuators, and control systems, enabling efficient monitoring and control of industrial processes.9. Smart Energy Management: This chip can be employed in smart energy management systems to enable wireless communication between smart meters, energy monitoring devices, and utility networks, facilitating efficient energy consumption and management.10. Asset Tracking: The SIM3C144-B-GMR chip can be used in asset tracking systems, enabling wireless communication and real-time tracking of assets in logistics, transportation, and supply chain management.Overall, the SIM3C144-B-GMR integrated circuit chip offers advantages such as low power consumption, high integration, and cost-effectiveness, making it suitable for a wide range of wireless communication applications in various industries.
SN74LV07APWT Relevant information