SN74AC245NSR

SN74AC245NSR

Manufacturer No:

SN74AC245NSR

Manufacturer:

Texas Instruments

Description:

IC TXRX NON-INVERT 6V 20SO

Datasheet:

Datasheet

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SN74AC245NSR Specifications

  • Type
    Parameter
  • Supplier Device Package
    20-SO
  • Package / Case
    20-SOIC (0.209", 5.30mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C (TA)
  • Voltage - Supply
    2V ~ 6V
  • Current - Output High, Low
    24mA, 24mA
  • Output Type
    3-State
  • Input Type
    -
  • Number of Bits per Element
    8
  • Number of Elements
    1
  • Logic Type
    Transceiver, Non-Inverting
  • Packaging
    Cut Tape (CT)
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Active
  • Series
    74AC
The DSPIC33FJ128MC710A-I/PT integrated circuit chips have several advantages and application scenarios:Advantages: 1. High-performance: These chips are based on the dsPIC33F core, which offers high computational performance and efficient instruction execution. 2. Digital Signal Processing (DSP) capabilities: The chips have a wide range of DSP features, including a 40 MIPS (Million Instructions Per Second) performance, 16-bit fixed-point math, and a variety of DSP instructions. 3. Enhanced connectivity: They offer various communication interfaces such as UART, SPI, I2C, and CAN, enabling easy integration with other devices and systems. 4. Rich peripheral set: The chips come with a wide range of peripherals, including timers, PWM modules, ADCs, and DACs, providing flexibility for different application requirements. 5. Low power consumption: They have low power modes and features like Sleep, Idle, and Doze modes, making them suitable for battery-powered applications.Application scenarios: 1. Motor control: The chips' high-performance DSP capabilities and PWM modules make them suitable for motor control applications, such as robotics, industrial automation, and electric vehicles. 2. Power electronics: With their high computational power and ADC/DAC modules, these chips can be used in power electronics applications like power inverters, power supplies, and renewable energy systems. 3. Communication systems: The integrated communication interfaces and DSP capabilities make these chips suitable for applications in wireless communication systems, such as IoT devices, wireless sensor networks, and smart home automation. 4. Audio processing: The DSP capabilities and ADC/DAC modules make these chips suitable for audio processing applications, including audio effects processors, audio amplifiers, and digital audio mixers. 5. Medical devices: The chips' low power consumption, DSP capabilities, and communication interfaces make them suitable for medical devices like patient monitoring systems, medical imaging, and diagnostic equipment.Overall, the DSPIC33FJ128MC710A-I/PT integrated circuit chips offer high-performance DSP capabilities, enhanced connectivity, and a rich peripheral set, making them suitable for a wide range of applications in various industries.