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74ALVC16244APAG8

74ALVC16244APAG8

Manufacturer No:

74ALVC16244APAG8

Description:

IC BUFF NON-INVERT 3.6V 48TSSOP

Datasheet:

Datasheet

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74ALVC16244APAG8 Specifications

  • Type
    Parameter
  • Supplier Device Package
    48-TSSOP
  • Package / Case
    48-TFSOP (0.240", 6.10mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C (TA)
  • Voltage - Supply
    2.7V ~ 3.6V
  • Current - Output High, Low
    24mA, 24mA
  • Output Type
    3-State
  • Input Type
    -
  • Number of Bits per Element
    4
  • Number of Elements
    4
  • Logic Type
    Buffer, Non-Inverting
  • Packaging
    Bulk
  • Product Status
    Active
  • Series
    74ALVC
The SPC56EL70L3CBFSY integrated circuit chips have several advantages and application scenarios:Advantages: 1. High Performance: The SPC56EL70L3CBFSY chips are based on the Power Architecture? technology and offer high-performance processing capabilities, making them suitable for demanding applications. 2. Enhanced Security: These chips come with advanced security features, including secure boot, secure firmware update, and cryptographic accelerators, ensuring the integrity and confidentiality of data. 3. Connectivity: The chips support various communication interfaces like CAN, LIN, FlexRay, and Ethernet, enabling seamless connectivity with other devices and systems. 4. Automotive Grade: The SPC56EL70L3CBFSY chips are designed for automotive applications and comply with the industry's stringent quality and reliability standards. 5. Low Power Consumption: These chips are optimized for low power consumption, making them suitable for battery-powered applications.Application Scenarios: 1. Automotive Electronics: The SPC56EL70L3CBFSY chips are commonly used in automotive electronics applications, such as engine control units (ECUs), body control modules (BCMs), and advanced driver-assistance systems (ADAS). 2. Industrial Automation: These chips can be utilized in industrial automation systems, including programmable logic controllers (PLCs), motor control units, and industrial communication gateways. 3. Smart Grids: The SPC56EL70L3CBFSY chips can be employed in smart grid applications, such as smart meters, energy management systems, and grid monitoring devices. 4. Internet of Things (IoT): With their connectivity features, these chips can be integrated into IoT devices, enabling secure and efficient communication between devices and the cloud. 5. Medical Devices: The SPC56EL70L3CBFSY chips can be used in medical devices, such as patient monitoring systems, medical imaging equipment, and diagnostic devices, where high performance and security are crucial.Overall, the SPC56EL70L3CBFSY integrated circuit chips offer high performance, enhanced security, and connectivity, making them suitable for a wide range of applications in automotive, industrial, IoT, and medical domains.
74ALVC16244APAG8 Relevant information