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74ALVC16244APAG

74ALVC16244APAG

Manufacturer No:

74ALVC16244APAG

Description:

IC BUFF NON-INVERT 3.6V 48TSSOP

Datasheet:

Datasheet

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74ALVC16244APAG Specifications

  • Type
    Parameter
  • Supplier Device Package
    48-TSSOP
  • Package / Case
    48-TFSOP (0.240", 6.10mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C (TA)
  • Voltage - Supply
    2.7V ~ 3.6V
  • Current - Output High, Low
    24mA, 24mA
  • Output Type
    3-State
  • Input Type
    -
  • Number of Bits per Element
    4
  • Number of Elements
    4
  • Logic Type
    Buffer, Non-Inverting
  • Packaging
    Bulk
  • Product Status
    Active
  • Series
    74ALVC
The SPC56EL70L3CBFSR integrated circuit chips have several advantages and application scenarios:Advantages: 1. High Performance: The SPC56EL70L3CBFSR chips are based on the Power Architecture? technology and offer high-performance processing capabilities, making them suitable for demanding applications. 2. Enhanced Security: These chips come with advanced security features, including secure boot, secure firmware update, and cryptographic accelerators, ensuring the integrity and confidentiality of data. 3. Connectivity: The chips support various communication interfaces such as CAN, LIN, FlexRay, and Ethernet, enabling seamless connectivity with other devices and systems. 4. Automotive Grade: The SPC56EL70L3CBFSR chips are designed for automotive applications and comply with the industry's stringent quality and reliability standards. 5. Low Power Consumption: These chips are optimized for low power consumption, making them suitable for battery-powered applications.Application Scenarios: 1. Automotive Systems: The SPC56EL70L3CBFSR chips are commonly used in automotive systems such as engine control units (ECUs), body control modules (BCMs), and advanced driver-assistance systems (ADAS). They provide the necessary processing power and connectivity for these applications. 2. Industrial Automation: These chips can be used in industrial automation systems for tasks such as motor control, machine vision, and communication with other devices on the factory floor. 3. Smart Grids: The SPC56EL70L3CBFSR chips can be employed in smart grid applications for monitoring and controlling power distribution, ensuring efficient energy management and grid stability. 4. Internet of Things (IoT): With their connectivity features, these chips can be utilized in IoT devices for data collection, processing, and communication with cloud platforms. 5. Consumer Electronics: The SPC56EL70L3CBFSR chips can be integrated into various consumer electronics products, such as home appliances, gaming consoles, and multimedia systems, to provide high-performance processing capabilities and connectivity options.Overall, the SPC56EL70L3CBFSR integrated circuit chips offer high performance, enhanced security, and connectivity features, making them suitable for a wide range of applications in automotive, industrial, IoT, and consumer electronics domains.
74ALVC16244APAG Relevant information