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74LVT16244BDGG,518

74LVT16244BDGG,518

Manufacturer No:

74LVT16244BDGG,518

Manufacturer:

Nexperia USA Inc.

Description:

IC BUF NON-INVERT 3.6V 48TSSOP

Datasheet:

Datasheet

Delivery:

Payment:

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74LVT16244BDGG,518 Specifications

  • Type
    Parameter
  • Supplier Device Package
    48-TSSOP
  • Package / Case
    48-TFSOP (0.240", 6.10mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C (TA)
  • Voltage - Supply
    2.7V ~ 3.6V
  • Current - Output High, Low
    32mA, 64mA
  • Output Type
    3-State
  • Input Type
    -
  • Number of Bits per Element
    4
  • Number of Elements
    4
  • Logic Type
    Buffer, Non-Inverting
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Obsolete
  • Series
    74LVT
The SPC56AP60L5CEFBY integrated circuit (IC) chips have several advantages and application scenarios. Some of them are:Advantages: 1. High Performance: The SPC56AP60L5CEFBY chips are based on the Power Architecture? technology and offer high-performance processing capabilities. They are equipped with a 32-bit Power Architecture? e200z0h core, which provides efficient and fast execution of instructions.2. Enhanced Security: These chips come with advanced security features, including a hardware security module (HSM) and secure boot capabilities. This ensures the protection of sensitive data and prevents unauthorized access to the system.3. Connectivity Options: The SPC56AP60L5CEFBY chips support various communication interfaces such as CAN, LIN, FlexRay, and Ethernet. This enables seamless integration with different communication protocols and facilitates connectivity in automotive and industrial applications.4. Robust Design: These chips are designed to operate in harsh environments and are resistant to electromagnetic interference (EMI) and electrostatic discharge (ESD). They have a wide operating temperature range, making them suitable for automotive and industrial applications.Application Scenarios: 1. Automotive Systems: The SPC56AP60L5CEFBY chips are widely used in automotive applications such as engine control units (ECUs), body control modules (BCMs), and advanced driver-assistance systems (ADAS). They provide the necessary processing power and connectivity options required for these applications.2. Industrial Automation: These chips find applications in industrial automation systems, including programmable logic controllers (PLCs), motor control units, and industrial communication gateways. The high-performance processing capabilities and robust design make them suitable for demanding industrial environments.3. Smart Grids: The SPC56AP60L5CEFBY chips can be used in smart grid systems for monitoring and controlling power distribution. They enable secure communication between different components of the smart grid and provide real-time data processing capabilities.4. Medical Devices: These chips can be utilized in medical devices such as patient monitoring systems, infusion pumps, and diagnostic equipment. The high-performance processing and security features ensure reliable and accurate operation of these devices.Overall, the SPC56AP60L5CEFBY IC chips offer high performance, enhanced security, and connectivity options, making them suitable for a wide range of applications in automotive, industrial, smart grid, and medical sectors.
74LVT16244BDGG,518 Relevant information