SN74AC245DBR
Manufacturer No:
SN74AC245DBR
Manufacturer:
Description:
IC TXRX NON-INVERT 6V 20SSOP
Datasheet:
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In Stock : 1732
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SN74AC245DBR Specifications
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TypeParameter
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Supplier Device Package20-SSOP
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Package / Case20-SSOP (0.209", 5.30mm Width)
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Mounting TypeSurface Mount
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Operating Temperature-40°C ~ 85°C (TA)
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Voltage - Supply2V ~ 6V
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Current - Output High, Low24mA, 24mA
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Output Type3-State
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Input Type-
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Number of Bits per Element8
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Number of Elements1
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Logic TypeTransceiver, Non-Inverting
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PackagingCut Tape (CT)
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PackagingTape & Reel (TR)
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Product StatusActive
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Series74AC
The SPC56EL54L3CBFSY integrated circuit chips have several advantages and application scenarios:Advantages: 1. High Performance: The SPC56EL54L3CBFSY chips are based on the Power Architecture? technology and offer high-performance processing capabilities, making them suitable for demanding applications. 2. Enhanced Security: These chips come with advanced security features, including secure boot, secure firmware update, and cryptographic accelerators, ensuring the protection of sensitive data and preventing unauthorized access. 3. Connectivity: The chips support various communication interfaces such as CAN, LIN, FlexRay, and Ethernet, enabling seamless connectivity with other devices and systems. 4. Robustness: The SPC56EL54L3CBFSY chips are designed to operate in harsh environments, with features like extended temperature range, high resistance to electromagnetic interference, and robust packaging. 5. Low Power Consumption: These chips are optimized for low power consumption, making them suitable for applications where energy efficiency is crucial.Application Scenarios: 1. Automotive: The SPC56EL54L3CBFSY chips are commonly used in automotive applications, such as engine control units (ECUs), body control modules (BCMs), advanced driver-assistance systems (ADAS), and infotainment systems. Their high performance, connectivity options, and robustness make them ideal for automotive environments. 2. Industrial Automation: These chips find applications in industrial automation systems, including programmable logic controllers (PLCs), motor control units, and industrial communication gateways. The high processing power and connectivity features enable efficient control and communication in industrial environments. 3. Smart Grids: The SPC56EL54L3CBFSY chips can be used in smart grid systems for monitoring and controlling power distribution, ensuring efficient energy management, and enabling communication between various components of the grid. 4. Medical Devices: These chips can be utilized in medical devices such as patient monitoring systems, diagnostic equipment, and medical imaging devices. The high performance, security features, and connectivity options make them suitable for critical medical applications. 5. Aerospace and Defense: The SPC56EL54L3CBFSY chips can be employed in aerospace and defense systems, including avionics, flight control systems, and military-grade communication systems. Their robustness, security features, and high performance make them suitable for demanding aerospace and defense applications.Overall, the SPC56EL54L3CBFSY integrated circuit chips offer high performance, enhanced security, connectivity, and robustness, making them suitable for a wide range of applications in automotive, industrial automation, smart grids, medical devices, and aerospace and defense industries.
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