MC74ACT540DWR2G

MC74ACT540DWR2G

Manufacturer No:

MC74ACT540DWR2G

Manufacturer:

onsemi

Description:

IC BUFFER INVERT 5.5V 20SOIC

Datasheet:

Datasheet

Delivery:

Payment:

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MC74ACT540DWR2G Specifications

  • Type
    Parameter
  • Supplier Device Package
    20-SOIC
  • Package / Case
    20-SOIC (0.295", 7.50mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C (TA)
  • Voltage - Supply
    4.5V ~ 5.5V
  • Current - Output High, Low
    24mA, 24mA
  • Output Type
    3-State
  • Input Type
    -
  • Number of Bits per Element
    8
  • Number of Elements
    1
  • Logic Type
    Buffer, Inverting
  • Packaging
    Cut Tape (CT)
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Active
  • Series
    74ACT
The CY8C3866FNI-210T is a specific model of the PSoC 3 family of integrated circuit chips developed by Cypress Semiconductor. These chips are designed for use in a wide range of applications, offering several advantages and application scenarios:1. Flexibility: The PSoC 3 family chips, including the CY8C3866FNI-210T, are known for their flexibility. They feature a programmable system-on-chip architecture, allowing users to configure and customize the chip's functionality to meet specific application requirements. This flexibility makes them suitable for a wide range of applications.2. Integration: The CY8C3866FNI-210T integrates various components and peripherals, including a microcontroller, digital and analog blocks, and communication interfaces. This integration reduces the need for external components, simplifying the overall system design and reducing the bill of materials.3. Low power consumption: The PSoC 3 family chips are designed to be power-efficient, making them suitable for battery-powered applications or devices that require low power consumption. The CY8C3866FNI-210T chip incorporates power-saving features and low-power modes to optimize energy usage.4. Mixed-signal capabilities: The CY8C3866FNI-210T chip offers a combination of digital and analog capabilities. It includes analog-to-digital converters (ADCs), digital-to-analog converters (DACs), and programmable analog blocks, enabling the chip to handle both digital and analog signals. This makes it suitable for applications that require mixed-signal processing, such as sensor interfaces, data acquisition systems, and audio processing.5. Communication interfaces: The CY8C3866FNI-210T chip supports various communication interfaces, including UART, SPI, I2C, and USB. These interfaces enable seamless connectivity with other devices or systems, making the chip suitable for applications that require communication and data exchange.Application scenarios for the CY8C3866FNI-210T chip include:1. Internet of Things (IoT) devices: The flexibility, low power consumption, and communication capabilities of the chip make it suitable for IoT applications. It can be used in smart home devices, wearable devices, industrial monitoring systems, and other IoT-enabled devices.2. Industrial automation: The CY8C3866FNI-210T chip's mixed-signal capabilities and communication interfaces make it suitable for industrial automation applications. It can be used in motor control systems, process control systems, and industrial monitoring and data acquisition systems.3. Consumer electronics: The chip's flexibility and integration make it suitable for various consumer electronics applications. It can be used in smart appliances, remote controls, gaming peripherals, and audio/video equipment.4. Medical devices: The CY8C3866FNI-210T chip's low power consumption, mixed-signal capabilities, and communication interfaces make it suitable for medical devices. It can be used in patient monitoring systems, medical sensors, and portable medical devices.Overall, the CY8C3866FNI-210T chip offers a combination of flexibility, integration, low power consumption, and mixed-signal capabilities, making it suitable for a wide range of applications in different industries.