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IDT74FCT827BTPY

IDT74FCT827BTPY

Manufacturer No:

IDT74FCT827BTPY

Description:

IC BUFF NON-INVERT 5.25V 24SSOP

Datasheet:

Datasheet

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IDT74FCT827BTPY Specifications

  • Type
    Parameter
  • Supplier Device Package
    24-SSOP
  • Package / Case
    24-SSOP (0.209", 5.30mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C (TA)
  • Voltage - Supply
    4.75V ~ 5.25V
  • Current - Output High, Low
    15mA, 48mA
  • Output Type
    3-State
  • Input Type
    -
  • Number of Bits per Element
    10
  • Number of Elements
    1
  • Logic Type
    Buffer, Non-Inverting
  • Packaging
    Bulk
  • Product Status
    Active
  • Series
    -
The XLF216-512-FB236-C20A integrated circuit chips have several advantages and application scenarios:Advantages: 1. High Performance: These chips offer high-speed processing capabilities, making them suitable for applications that require fast data processing. 2. Large Memory Capacity: With a memory capacity of 512 kilobytes, these chips can store a significant amount of data, enabling complex applications. 3. Low Power Consumption: The XLF216-512-FB236-C20A chips are designed to operate with low power consumption, making them energy-efficient and suitable for battery-powered devices. 4. Compact Size: These chips are compact in size, allowing for easy integration into various electronic devices and systems. 5. Robust Design: The chips are built with a robust design, ensuring reliability and durability in demanding environments.Application Scenarios: 1. Internet of Things (IoT): The XLF216-512-FB236-C20A chips can be used in IoT devices for data processing, storage, and communication. 2. Embedded Systems: These chips are suitable for embedded systems that require high-performance computing and memory capabilities, such as industrial automation, robotics, and automotive applications. 3. Consumer Electronics: The chips can be used in various consumer electronic devices, including smartphones, tablets, and wearable devices, to enhance their processing power and memory capacity. 4. Communication Systems: These chips can be utilized in communication systems, such as routers, switches, and network equipment, to handle data processing and storage requirements. 5. Medical Devices: The XLF216-512-FB236-C20A chips can be integrated into medical devices, such as patient monitoring systems and diagnostic equipment, to enable fast and efficient data processing.It's important to note that the specific advantages and application scenarios may vary depending on the requirements and specifications of the system in which the chips are used.
IDT74FCT827BTPY Relevant information