74HC365D-Q100,118

74HC365D-Q100,118

Manufacturer No:

74HC365D-Q100,118

Manufacturer:

Nexperia USA Inc.

Description:

IC BUFFER NON-INVERT 6V 16SO

Datasheet:

Datasheet

Delivery:

Payment:

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74HC365D-Q100,118 Specifications

  • Type
    Parameter
  • Supplier Device Package
    16-SO
  • Package / Case
    16-SOIC (0.154", 3.90mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 125°C (TA)
  • Voltage - Supply
    2V ~ 6V
  • Current - Output High, Low
    7.8mA, 7.8mA
  • Output Type
    3-State
  • Input Type
    -
  • Number of Bits per Element
    6
  • Number of Elements
    1
  • Logic Type
    Buffer, Non-Inverting
  • Packaging
    Cut Tape (CT)
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Active
  • Series
    Automotive, AEC-Q100, 74HC
The MB89697BPFM-G-275 is a specific model of integrated circuit (IC) chip manufactured by Fujitsu. While specific advantages and application scenarios may vary depending on the specific requirements and use cases, here are some general advantages and potential application scenarios for this chip:Advantages: 1. High Performance: The MB89697BPFM-G-275 chip is designed to deliver high performance with a powerful CPU core and advanced features. 2. Low Power Consumption: It is optimized for low power consumption, making it suitable for battery-powered devices or applications where energy efficiency is crucial. 3. Integrated Peripherals: The chip integrates various peripherals such as UART, I2C, SPI, timers, and GPIOs, reducing the need for external components and simplifying the overall system design. 4. Wide Operating Temperature Range: The chip is designed to operate reliably across a wide temperature range, making it suitable for applications in harsh environments. 5. Small Form Factor: The compact size of the chip enables it to be used in space-constrained applications.Application Scenarios: 1. Industrial Automation: The MB89697BPFM-G-275 chip can be used in industrial automation systems for controlling and monitoring various processes. Its high performance and integrated peripherals make it suitable for applications such as PLCs (Programmable Logic Controllers) or industrial control systems. 2. Internet of Things (IoT): With its low power consumption and integrated peripherals, the chip can be used in IoT devices such as smart sensors, smart meters, or wearable devices. It can enable efficient data processing and communication in these connected devices. 3. Consumer Electronics: The chip can be utilized in various consumer electronic devices such as home appliances, gaming consoles, or multimedia devices. Its high performance and integrated peripherals can enhance the functionality and user experience of these devices. 4. Automotive Electronics: The chip's wide operating temperature range and robust design make it suitable for automotive applications. It can be used in automotive control systems, infotainment systems, or advanced driver-assistance systems (ADAS). 5. Medical Devices: The chip's low power consumption and compact size make it suitable for medical devices such as portable medical monitors, patient monitoring systems, or medical imaging equipment.It is important to note that the specific advantages and application scenarios may vary depending on the requirements and specifications of the target application. It is recommended to refer to the manufacturer's documentation and consult with experts for detailed information and suitability for specific use cases.