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SN74HC541APW

SN74HC541APW

Manufacturer No:

SN74HC541APW

Manufacturer:

Texas Instruments

Description:

IC BUFFER NON-INVERT 6V 20TSSOP

Datasheet:

Datasheet

Delivery:

Payment:

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SN74HC541APW Specifications

  • Type
    Parameter
  • Supplier Device Package
    20-TSSOP
  • Package / Case
    20-TSSOP (0.173", 4.40mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C (TA)
  • Voltage - Supply
    2V ~ 6V
  • Current - Output High, Low
    7.8mA, 7.8mA
  • Output Type
    3-State
  • Input Type
    -
  • Number of Bits per Element
    8
  • Number of Elements
    1
  • Logic Type
    Buffer, Non-Inverting
  • Packaging
    Bulk
  • Product Status
    Active
  • Series
    74HC
The MB90022PF-GS-136-BND is a specific model of integrated circuit (IC) chip manufactured by Fujitsu. While specific advantages and application scenarios may vary depending on the specific requirements and use cases, here are some general advantages and potential application scenarios for this IC chip:Advantages: 1. High Performance: The MB90022PF-GS-136-BND is designed to deliver high performance with its powerful processing capabilities and optimized architecture. 2. Low Power Consumption: This IC chip is designed to operate efficiently with low power consumption, making it suitable for battery-powered devices or applications where power efficiency is crucial. 3. Compact Size: The chip's compact size allows for easy integration into various electronic devices, making it suitable for applications with space constraints. 4. Versatility: The MB90022PF-GS-136-BND is a versatile chip that can be used in a wide range of applications, thanks to its flexible architecture and support for various peripherals and interfaces. 5. Reliability: Fujitsu is known for producing reliable and high-quality IC chips, ensuring the longevity and stability of the MB90022PF-GS-136-BND.Application Scenarios: 1. Embedded Systems: The MB90022PF-GS-136-BND can be used in embedded systems, such as industrial automation, robotics, or automotive applications, where real-time processing, low power consumption, and compact size are essential. 2. Consumer Electronics: This IC chip can be utilized in various consumer electronic devices, including smart home appliances, wearable devices, or portable gadgets, where a balance between performance and power efficiency is required. 3. Internet of Things (IoT): With its low power consumption and compact size, the MB90022PF-GS-136-BND can be used in IoT devices, such as sensors, gateways, or edge computing devices, enabling efficient data processing and connectivity. 4. Communication Systems: The chip's high performance and support for various communication interfaces make it suitable for applications in communication systems, such as routers, switches, or network equipment. 5. Medical Devices: The MB90022PF-GS-136-BND can be employed in medical devices, such as patient monitoring systems, diagnostic equipment, or portable medical devices, where reliability, performance, and power efficiency are critical.It's important to note that the specific advantages and application scenarios may vary depending on the requirements and specifications of the project or product where the MB90022PF-GS-136-BND is being used.
SN74HC541APW Relevant information