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74LVC3G17DP-Q100H

74LVC3G17DP-Q100H

Manufacturer No:

74LVC3G17DP-Q100H

Manufacturer:

Nexperia USA Inc.

Description:

IC BUF NON-INVERT 5.5V 8TSSOP

Datasheet:

Datasheet

Delivery:

Payment:

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74LVC3G17DP-Q100H Specifications

  • Type
    Parameter
  • Supplier Device Package
    8-TSSOP
  • Package / Case
    8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 125°C (TA)
  • Voltage - Supply
    1.65V ~ 5.5V
  • Current - Output High, Low
    32mA, 32mA
  • Output Type
    Push-Pull
  • Input Type
    Schmitt Trigger
  • Number of Bits per Element
    1
  • Number of Elements
    3
  • Logic Type
    Buffer, Non-Inverting
  • Packaging
    Cut Tape (CT)
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Active
  • Series
    Automotive, AEC-Q100, 74LVC
The MB90022PF-GS-161-BND is a specific model of integrated circuit (IC) chip manufactured by Fujitsu. While specific advantages and application scenarios may vary depending on the specific requirements and use cases, here are some general advantages and potential application scenarios for this IC chip:Advantages: 1. High Performance: The MB90022PF-GS-161-BND is designed to deliver high performance with its powerful processing capabilities and optimized architecture. 2. Low Power Consumption: This IC chip is designed to operate efficiently with low power consumption, making it suitable for battery-powered devices or applications where power efficiency is crucial. 3. Compact Size: The chip's compact size allows for easy integration into various electronic devices, making it suitable for applications with space constraints. 4. Versatility: The MB90022PF-GS-161-BND is a versatile chip that can be used in a wide range of applications, thanks to its flexible architecture and support for various peripherals and interfaces. 5. Reliability: Fujitsu is known for producing reliable and high-quality IC chips, ensuring the longevity and stability of the MB90022PF-GS-161-BND.Application Scenarios: 1. Embedded Systems: The MB90022PF-GS-161-BND can be used in embedded systems, such as industrial automation, robotics, or automotive applications, where real-time processing, low power consumption, and compact size are essential. 2. Consumer Electronics: This IC chip can be utilized in various consumer electronic devices, including smart home appliances, wearable devices, or portable gadgets, where a balance between performance and power efficiency is required. 3. Internet of Things (IoT): With its low power consumption and versatile architecture, the MB90022PF-GS-161-BND can be used in IoT devices, enabling connectivity, data processing, and control in smart homes, industrial IoT, or environmental monitoring systems. 4. Communication Systems: The chip's processing capabilities and support for various communication interfaces make it suitable for applications in communication systems, such as routers, switches, or network gateways. 5. Medical Devices: The MB90022PF-GS-161-BND can be employed in medical devices, such as patient monitoring systems, diagnostic equipment, or portable medical devices, where reliability, performance, and power efficiency are crucial.It's important to note that the specific advantages and application scenarios may vary depending on the requirements and specifications of the project or product where the MB90022PF-GS-161-BND is being used.
74LVC3G17DP-Q100H Relevant information