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SN74LVC1G34YFPR

SN74LVC1G34YFPR

Manufacturer No:

SN74LVC1G34YFPR

Manufacturer:

Texas Instruments

Description:

IC BUF NON-INVERT 5.5V 4DSBGA

Datasheet:

Datasheet

Delivery:

Payment:

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SN74LVC1G34YFPR Specifications

  • Type
    Parameter
  • Supplier Device Package
    4-DSBGA
  • Package / Case
    4-XFBGA, DSBGA
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C (TA)
  • Voltage - Supply
    1.65V ~ 5.5V
  • Current - Output High, Low
    32mA, 32mA
  • Output Type
    Push-Pull
  • Input Type
    -
  • Number of Bits per Element
    1
  • Number of Elements
    1
  • Logic Type
    Buffer, Non-Inverting
  • Packaging
    Cut Tape (CT)
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Active
  • Series
    74LVC
The XE167F96F66LACFXUMA1 integrated circuit chips have several advantages and application scenarios:Advantages: 1. High Performance: These chips are based on the TriCore? architecture, which combines a 32-bit microcontroller core with a DSP (Digital Signal Processor) core. This allows for high-performance computing capabilities, making them suitable for demanding applications. 2. Integrated Peripherals: The chips come with a wide range of integrated peripherals, including CAN (Controller Area Network), LIN (Local Interconnect Network), SPI (Serial Peripheral Interface), and UART (Universal Asynchronous Receiver-Transmitter). This integration reduces the need for external components and simplifies the design process. 3. Enhanced Safety and Security: The chips feature advanced safety and security features, such as memory protection units, watchdog timers, and hardware breakpoints. These features ensure the reliability and integrity of the system, making them suitable for safety-critical applications. 4. Low Power Consumption: The chips are designed to operate at low power, making them suitable for battery-powered applications or devices with strict power constraints. 5. Scalability: The chips are part of the XMC1000 microcontroller series, which offers a range of devices with different memory sizes and peripheral configurations. This scalability allows for flexibility in choosing the right chip for specific application requirements.Application Scenarios: 1. Automotive Systems: The XE167F96F66LACFXUMA1 chips are commonly used in automotive systems, such as engine control units, transmission control units, and body control modules. The high-performance computing capabilities and integrated communication interfaces make them suitable for these applications. 2. Industrial Automation: These chips can be used in industrial automation systems, such as programmable logic controllers (PLCs), motor control units, and human-machine interfaces (HMIs). The integrated peripherals and safety features make them suitable for these applications. 3. Renewable Energy Systems: The chips can be used in renewable energy systems, such as solar inverters and wind turbine control units. The high-performance computing capabilities and low power consumption make them suitable for these applications. 4. Home Automation: These chips can be used in home automation systems, such as smart lighting control, HVAC (Heating, Ventilation, and Air Conditioning) control, and security systems. The integrated peripherals and low power consumption make them suitable for these applications. 5. Medical Devices: The chips can be used in medical devices, such as patient monitoring systems, infusion pumps, and diagnostic equipment. The high-performance computing capabilities and safety features make them suitable for these applications.Overall, the XE167F96F66LACFXUMA1 integrated circuit chips offer high performance, integrated peripherals, safety features, low power consumption, and scalability, making them suitable for a wide range of applications in automotive, industrial, renewable energy, home automation, and medical sectors.
SN74LVC1G34YFPR Relevant information