SN74AUP1G07DSFR

SN74AUP1G07DSFR

Manufacturer No:

SN74AUP1G07DSFR

Manufacturer:

Texas Instruments

Description:

IC BUFFER NON-INVERT 3.6V 6SON

Datasheet:

Datasheet

Delivery:

Payment:

Please send RFQ , we will respond immediately.

SN74AUP1G07DSFR Specifications

  • Type
    Parameter
  • Supplier Device Package
    6-SON (1x1)
  • Package / Case
    6-XFDFN
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C (TA)
  • Voltage - Supply
    0.8V ~ 3.6V
  • Current - Output High, Low
    -, 4mA
  • Output Type
    Open Drain
  • Input Type
    -
  • Number of Bits per Element
    1
  • Number of Elements
    1
  • Logic Type
    Buffer, Non-Inverting
  • Packaging
    Cut Tape (CT)
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Active
  • Series
    74AUP
The MB89697BPFM-G-140-BND integrated circuit chips have several advantages and application scenarios:Advantages: 1. High Performance: These chips are designed to deliver high performance with a 16-bit microcontroller core running at a maximum frequency of 20 MHz. 2. Low Power Consumption: They are optimized for low power consumption, making them suitable for battery-powered devices or applications where power efficiency is crucial. 3. Rich Peripherals: The chips come with a wide range of built-in peripherals, including UART, I2C, SPI, timers, PWM, and ADC, providing flexibility for various applications. 4. Ample Memory: They have a large memory capacity, including up to 256 KB of flash memory for program storage and up to 16 KB of RAM for data storage. 5. Enhanced Security: These chips offer security features like a hardware encryption engine and a memory protection unit, ensuring data integrity and protection against unauthorized access.Application Scenarios: 1. Industrial Automation: The MB89697BPFM-G-140-BND chips can be used in industrial automation systems for controlling and monitoring processes, thanks to their high performance, low power consumption, and rich peripheral support. 2. Consumer Electronics: They are suitable for various consumer electronic devices, such as smart home appliances, wearable devices, and IoT devices, due to their low power consumption, ample memory, and built-in communication interfaces. 3. Automotive Electronics: These chips can be utilized in automotive applications, including engine control units, dashboard systems, and advanced driver-assistance systems (ADAS), benefiting from their high performance, security features, and robustness. 4. Medical Devices: The chips can be employed in medical devices like patient monitoring systems, portable medical instruments, and diagnostic equipment, leveraging their low power consumption, memory capacity, and communication capabilities. 5. Internet of Things (IoT): With their low power consumption, rich peripherals, and security features, these chips are well-suited for IoT applications, such as smart sensors, smart meters, and connected devices, enabling efficient and secure data processing.It is important to note that the specific advantages and application scenarios may vary depending on the requirements and specifications of the project or system in which the chips are being used.