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SN74AUP1G17YFPR

SN74AUP1G17YFPR

Manufacturer No:

SN74AUP1G17YFPR

Manufacturer:

Texas Instruments

Description:

IC BUF NON-INVERT 3.6V 4DSBGA

Datasheet:

Datasheet

Delivery:

Payment:

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SN74AUP1G17YFPR Specifications

  • Type
    Parameter
  • Supplier Device Package
    4-DSBGA
  • Package / Case
    4-XFBGA, DSBGA
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C (TA)
  • Voltage - Supply
    0.8V ~ 3.6V
  • Current - Output High, Low
    4mA, 4mA
  • Output Type
    Push-Pull
  • Input Type
    Schmitt Trigger
  • Number of Bits per Element
    1
  • Number of Elements
    1
  • Logic Type
    Buffer, Non-Inverting
  • Packaging
    Cut Tape (CT)
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Active
  • Series
    74AUP
The MB90022PF-GS-193-BND is a specific model of an integrated circuit chip, and its advantages and application scenarios can vary depending on the specific features and capabilities of the chip. Unfortunately, without more information about the chip's specifications, it is difficult to provide a comprehensive answer. However, in general, integrated circuit chips like the MB90022PF-GS-193-BND offer several advantages and can be used in various application scenarios. Some potential advantages and application scenarios of integrated circuit chips include:1. Miniaturization: Integrated circuit chips are compact and can be manufactured in small sizes, allowing for miniaturization of electronic devices. This makes them suitable for applications where space is limited, such as in mobile phones, wearables, and IoT devices.2. Power efficiency: Integrated circuit chips are designed to be power-efficient, which is crucial for battery-powered devices. They can help extend the battery life of portable devices and reduce power consumption in various applications.3. High performance: Integrated circuit chips can offer high processing power, speed, and performance. They can be used in applications that require complex calculations, data processing, or real-time operations, such as in automotive systems, industrial automation, or high-performance computing.4. Cost-effectiveness: Integrated circuit chips can be mass-produced, leading to economies of scale and cost-effectiveness. This makes them suitable for consumer electronics, where cost plays a significant role.5. Versatility: Integrated circuit chips can be designed for specific functionalities or can be programmable, allowing for versatility in their applications. They can be used in a wide range of industries, including telecommunications, automotive, healthcare, aerospace, and more.It is important to note that the specific advantages and application scenarios of the MB90022PF-GS-193-BND chip may differ based on its unique features, such as its architecture, processing capabilities, input/output interfaces, and supported protocols. To get a more accurate understanding of the advantages and application scenarios of this specific chip, it is recommended to refer to the manufacturer's datasheet or technical documentation.
SN74AUP1G17YFPR Relevant information