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74ACT16244DGGR

74ACT16244DGGR

Manufacturer No:

74ACT16244DGGR

Manufacturer:

Texas Instruments

Description:

IC BUF NON-INVERT 5.5V 48TSSOP

Datasheet:

Datasheet

Delivery:

Payment:

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74ACT16244DGGR Specifications

  • Type
    Parameter
  • Supplier Device Package
    48-TSSOP
  • Package / Case
    48-TFSOP (0.240", 6.10mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C (TA)
  • Voltage - Supply
    4.5V ~ 5.5V
  • Current - Output High, Low
    24mA, 24mA
  • Output Type
    3-State
  • Input Type
    -
  • Number of Bits per Element
    4
  • Number of Elements
    4
  • Logic Type
    Buffer, Non-Inverting
  • Packaging
    Cut Tape (CT)
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Active
  • Series
    74ACT
The R7FS5D97E3A01CFB#BA0 is a specific model of integrated circuit chip developed by Renesas Electronics Corporation. While specific advantages and application scenarios may vary depending on the requirements and use cases, here are some general advantages and potential application scenarios for this chip:Advantages: 1. High-performance: The R7FS5D97E3A01CFB#BA0 chip is designed to deliver high-performance computing capabilities, making it suitable for demanding applications. 2. Low power consumption: It is optimized for low power consumption, making it suitable for battery-powered devices or applications where energy efficiency is crucial. 3. Rich peripheral set: The chip offers a wide range of built-in peripherals, such as timers, UART, I2C, SPI, ADC, and more, which can simplify the design process and reduce the need for external components. 4. Security features: It includes various security features like a hardware encryption engine, secure boot, and tamper detection, making it suitable for applications that require robust security measures. 5. Scalability: The chip is part of the Renesas Synergy Platform, which provides a scalable ecosystem of compatible devices, software, and development tools, allowing for easy scalability and future-proofing of the application.Application Scenarios: 1. Internet of Things (IoT) devices: The R7FS5D97E3A01CFB#BA0 chip's low power consumption, rich peripheral set, and security features make it suitable for IoT devices, such as smart home devices, wearables, or industrial sensors. 2. Industrial automation: With its high-performance computing capabilities and robust security features, the chip can be used in industrial automation applications, such as programmable logic controllers (PLCs), motor control systems, or robotics. 3. Consumer electronics: The chip's combination of performance, low power consumption, and security features can be utilized in various consumer electronics applications, including smart appliances, gaming consoles, or audio/video equipment. 4. Automotive systems: The R7FS5D97E3A01CFB#BA0 chip's scalability, security features, and compatibility with the Renesas Synergy Platform make it suitable for automotive applications, such as advanced driver-assistance systems (ADAS), infotainment systems, or engine control units (ECUs). 5. Medical devices: The chip's low power consumption, security features, and compatibility with the Renesas Synergy Platform can be leveraged in medical devices, such as patient monitoring systems, portable medical devices, or medical imaging equipment.It's important to note that the specific advantages and application scenarios may vary depending on the requirements and implementation of the chip in a particular system.
74ACT16244DGGR Relevant information