MC74LVX541DTR2

MC74LVX541DTR2

Manufacturer No:

MC74LVX541DTR2

Manufacturer:

onsemi

Description:

IC BUF NON-INVERT 3.6V 20TSSOP

Datasheet:

Datasheet

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MC74LVX541DTR2 Specifications

  • Type
    Parameter
  • Supplier Device Package
    20-TSSOP
  • Package / Case
    20-TSSOP (0.173", 4.40mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C (TA)
  • Voltage - Supply
    2V ~ 3.6V
  • Current - Output High, Low
    4mA, 4mA
  • Output Type
    3-State
  • Input Type
    -
  • Number of Bits per Element
    8
  • Number of Elements
    1
  • Logic Type
    Buffer, Non-Inverting
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Obsolete
  • Series
    74LVX
The MC74LVX541DTR2 integrated circuit chip is a 10-bit non-inverting buffer/line driver with 3-state outputs, which is manufactured by ON Semiconductor. Some of the advantages and application scenarios of this chip are as follows:Advantages: 1. High-speed operation: The chip is designed to operate at high speeds, making it suitable for applications that require fast signal processing. 2. Low power consumption: It is designed to consume low power, making it suitable for battery-powered devices or applications where power efficiency is important. 3. Wide operating voltage range: The chip can operate within a wide voltage range, allowing it to be compatible with various voltage levels and systems. 4. 3-state outputs: The 3-state outputs enable the chip to drive bus lines without the need for additional external components, simplifying the circuit design.Application Scenarios: 1. Buffering and signal amplification: The chip can be used to buffer and amplify signals in digital systems, ensuring signal integrity and reducing noise and distortion. 2. Data and address bus driving: With its 3-state outputs, the chip can drive data and address buses in microprocessors, microcontrollers, or other digital systems. 3. Level shifting: The chip can be used to shift logic levels between different voltage domains, facilitating communication between components operating at different voltage levels. 4. Interface conversion: It can be used to convert signals from one interface standard to another, such as TTL to CMOS or vice versa, enabling compatibility between different systems or devices. 5. Bus isolation: The chip can provide isolation between different sections of a system or between multiple devices, preventing interference or conflicts on shared buses.Overall, the MC74LVX541DTR2 integrated circuit chip provides high-speed, low-power, and versatile buffering and driving capabilities, making it suitable for a wide range of digital signal processing and interface applications.