74LVT16240ADGG,512

74LVT16240ADGG,512

Manufacturer No:

74LVT16240ADGG,512

Manufacturer:

Nexperia USA Inc.

Description:

IC BUF NON-INVERT 3.6V 48TSSOP

Datasheet:

Datasheet

Delivery:

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74LVT16240ADGG,512 Specifications

  • Type
    Parameter
  • Supplier Device Package
    48-TSSOP
  • Package / Case
    48-TFSOP (0.240", 6.10mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C (TA)
  • Voltage - Supply
    2.7V ~ 3.6V
  • Current - Output High, Low
    32mA, 64mA
  • Output Type
    3-State
  • Input Type
    -
  • Number of Bits per Element
    4
  • Number of Elements
    4
  • Logic Type
    Buffer, Inverting
  • Packaging
    Tube
  • Product Status
    Obsolete
  • Series
    74LVT
The 74LVT16240ADGG,512 integrated circuit chips have several advantages and application scenarios:Advantages: 1. Low voltage operation: These chips operate at a low voltage of 3.3V, which makes them suitable for use in battery-powered applications. 2. High-speed operation: These chips have a maximum operating frequency of 200MHz, which makes them suitable for use in high-speed data transfer applications. 3. Robust construction: The chips are designed to be highly durable and resistant to environmental stressors, making them ideal for use in rugged applications.Application scenarios: 1. Data transfer applications: These chips can be used to transfer data between different electronic devices, such as computers, smartphones, and tablets. 2. Industrial control systems: These chips can be used in industrial control systems to provide reliable and fast data transfer between various components of the system. 3. Automotive electronics: These chips can be used in automotive electronics, such as infotainment systems and navigation systems, to provide fast and reliable data transfer between different components of the system. 4. Medical electronics: These chips can be used in medical electronics, such as patient monitoring systems and medical imaging equipment, to provide high-speed data transfer between different components of the system.