74LVCH32245AEC,518

74LVCH32245AEC,518

Manufacturer No:

74LVCH32245AEC,518

Manufacturer:

NXP USA Inc.

Description:

IC TXRX NON-INVERT 3.6V 96LFBGA

Datasheet:

Datasheet

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74LVCH32245AEC,518 Specifications

  • Type
    Parameter
  • Supplier Device Package
    96-LFBGA (13.5x5.5)
  • Package / Case
    96-LFBGA
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 125°C (TA)
  • Voltage - Supply
    1.2V ~ 3.6V
  • Current - Output High, Low
    24mA, 24mA
  • Output Type
    3-State
  • Input Type
    -
  • Number of Bits per Element
    8
  • Number of Elements
    4
  • Logic Type
    Transceiver, Non-Inverting
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Obsolete
  • Series
    74LVCH
The 74LVCH32245AEC,518 is a 32-bit transceiver IC chip designed for operation at low voltage levels. Some of its advantages and potential application scenarios include:1. Voltage Level Translation: The chip provides bidirectional voltage level translation between different voltage domains, making it suitable for applications where different components or subsystems operate at different voltage levels.2. Low Voltage Operation: The chip is designed to operate at low voltage levels, typically 1.65V to 3.6V, making it suitable for low-power and portable devices.3. High-Speed Operation: The 74LVCH32245AEC,518 is designed for high-speed data transmission, compatible with up to 440 Mbps with a typical propagation delay of 2.5 ns at 3.3V supply.4. Tri-State Outputs: The chip features tri-state outputs, allowing connection with multiple devices without conflicts on the data bus.5. ESD Protection: The chip provides electrostatic discharge (ESD) protection, ensuring robustness against electrostatic discharges that can damage sensitive components.Application scenarios for the 74LVCH32245AEC,518 chip include:1. Mixed Voltage Systems: It can be used in systems with multiple voltage domains, such as interfacing low-power microcontrollers with higher voltage peripherals.2. Bus Buffering: The chip can be used to buffer and level shift data buses between different subsystems in embedded systems, ensuring reliable and efficient data exchange.3. Communication Interfaces: The high-speed operation and bidirectional capability make the chip suitable for implementing communication interfaces like SPI, I2C, or UART.4. Memory Modules: The chip can be used as a buffer or level shifter for connecting memory devices like RAM or Flash to microcontrollers or other processing units.5. Portable Devices: Due to its low power consumption and voltage range, the chip can be used in battery-powered devices like smartphones, tablets, or portable medical devices requiring voltage level translation.