74LVC646APW,112

74LVC646APW,112

Manufacturer No:

74LVC646APW,112

Manufacturer:

NXP USA Inc.

Description:

IC TXRX NON-INVERT 3.6V 24TSSOP

Datasheet:

Datasheet

Delivery:

Payment:

Please send RFQ , we will respond immediately.

74LVC646APW,112 Specifications

  • Type
    Parameter
  • Supplier Device Package
    24-TSSOP
  • Package / Case
    24-TSSOP (0.173", 4.40mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 125°C (TA)
  • Voltage - Supply
    1.2V ~ 3.6V
  • Current - Output High, Low
    24mA, 24mA
  • Output Type
    3-State
  • Input Type
    -
  • Number of Bits per Element
    8
  • Number of Elements
    1
  • Logic Type
    Transceiver, Non-Inverting
  • Packaging
    Tube
  • Product Status
    Obsolete
  • Series
    74LVC
The 74LVC646APW,112 is a specific integrated circuit chip that belongs to the 74LVC series. It is a 3.3V compatible octal bus transceiver with configurable voltage translation and 3-state outputs. Here are some advantages and application scenarios of this chip:Advantages: 1. Voltage Translation: The chip allows bidirectional voltage level translation between different voltage domains, making it suitable for interfacing between devices operating at different voltage levels. 2. Configurability: The voltage translation direction can be configured using the OE (Output Enable) and DIR (Direction) pins, providing flexibility in designing the interface. 3. High-Speed Operation: The chip supports high-speed data transmission, making it suitable for applications requiring fast data transfer. 4. 3-State Outputs: The 74LVC646APW,112 has 3-state outputs, which means the outputs can be disabled or put in a high-impedance state when not in use, reducing power consumption and allowing multiple devices to share a common bus.Application Scenarios: 1. Level Shifting: The chip can be used to interface between microcontrollers or other digital devices operating at different voltage levels, ensuring proper signal communication. 2. Bus Transceiver: It can be used as a bidirectional buffer for data buses, allowing data to be transferred between different parts of a system. 3. I/O Expansion: The chip can be used to expand the number of input/output pins of a microcontroller or FPGA, enabling connection to a larger number of peripheral devices. 4. Mixed Voltage Systems: It is suitable for applications where different parts of a system operate at different voltage levels, such as in battery-powered devices or mixed-voltage systems.It is important to note that the specific advantages and application scenarios may vary depending on the requirements and specifications of the overall system design.