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74AVC16835ADGV,118

74AVC16835ADGV,118

Manufacturer No:

74AVC16835ADGV,118

Manufacturer:

NXP USA Inc.

Description:

IC BUF NON-INVERT 3.6V 56TSSOP

Datasheet:

Datasheet

Delivery:

Payment:

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74AVC16835ADGV,118 Specifications

  • Type
    Parameter
  • Supplier Device Package
    56-TSSOP
  • Package / Case
    56-TFSOP (0.173", 4.40mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C (TA)
  • Voltage - Supply
    1.2V ~ 3.6V
  • Current - Output High, Low
    12mA, 12mA
  • Output Type
    3-State
  • Input Type
    -
  • Number of Bits per Element
    18
  • Number of Elements
    1
  • Logic Type
    Buffer, Non-Inverting
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Obsolete
  • Series
    74AVC
Advantages of 74AVC16835ADGV,118:1. Low voltage operation: The chip can operate at low voltage levels, making it suitable for use in portable devices.2. High-speed data transmission: With a maximum data transmission rate of 1.6 Gbps, the chip is suitable for high-speed data transfer applications.3. Wide voltage range: The chip operates within a wide voltage range, making it versatile for use in a variety of applications.4. Low power consumption: The chip has a low power consumption, which helps to reduce overall power consumption in a system.Application scenarios of 74AVC16835ADGV,118:1. Consumer electronics: The chip can be used in a wide range of consumer electronic devices such as smartphones, tablets, and laptops.2. Networking equipment: The chip can be used in networking equipment such as routers and switches, where high-speed data transmission is required.3. Industrial automation: The chip can be used in industrial automation equipment, where low voltage operation is necessary to reduce the risk of electrical hazards.4. Medical devices: The chip can be used in medical devices such as diagnostic equipment, where high-speed data transmission is required to deliver accurate readings.
74AVC16835ADGV,118 Relevant information