74ABT244CMTCX

74ABT244CMTCX

Manufacturer No:

74ABT244CMTCX

Manufacturer:

onsemi

Description:

IC BUF NON-INVERT 5.5V 20TSSOP

Datasheet:

Datasheet

Delivery:

Payment:

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74ABT244CMTCX Specifications

  • Type
    Parameter
  • Supplier Device Package
    20-TSSOP
  • Package / Case
    20-TSSOP (0.173", 4.40mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C (TA)
  • Voltage - Supply
    4.5V ~ 5.5V
  • Current - Output High, Low
    32mA, 64mA
  • Output Type
    3-State
  • Input Type
    -
  • Number of Bits per Element
    4
  • Number of Elements
    2
  • Logic Type
    Buffer, Non-Inverting
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Obsolete
  • Series
    74ABT
The MB89925PF-G-209-BND is a specific model of integrated circuit (IC) chip manufactured by Fujitsu. While specific advantages and application scenarios may vary depending on the requirements and context, here are some general advantages and potential application scenarios for this IC chip:Advantages: 1. High Performance: The MB89925PF-G-209-BND is designed to deliver high performance with its advanced architecture and features. It may offer fast processing speeds, efficient power consumption, and reliable operation.2. Integrated Features: This IC chip may include various integrated features such as a microcontroller unit (MCU), memory, communication interfaces, analog-to-digital converters (ADC), timers, and more. These integrated features can simplify the design process, reduce component count, and save board space.3. Versatility: The MB89925PF-G-209-BND can be programmed to perform a wide range of tasks, making it suitable for various applications. Its versatility allows it to be used in different scenarios, reducing the need for multiple specialized chips.4. Cost-Effective: By integrating multiple functions into a single chip, the MB89925PF-G-209-BND can potentially reduce overall system costs. It eliminates the need for additional components, simplifies the manufacturing process, and lowers the bill of materials.Application Scenarios: 1. Industrial Automation: The MB89925PF-G-209-BND can be used in industrial automation systems for tasks such as control, monitoring, and data acquisition. Its integrated features and high performance make it suitable for applications like motor control, sensor interfacing, and communication with other devices.2. Consumer Electronics: This IC chip can find applications in various consumer electronics devices such as home appliances, gaming consoles, audio systems, and more. It can provide the necessary processing power, control capabilities, and connectivity options required in these devices.3. Internet of Things (IoT): With its integrated features and versatility, the MB89925PF-G-209-BND can be utilized in IoT applications. It can serve as a central processing unit for IoT devices, enabling connectivity, data processing, and control functions.4. Automotive Electronics: The high performance and reliability of the MB89925PF-G-209-BND make it suitable for automotive applications. It can be used in systems like engine control units (ECUs), body control modules (BCMs), and other automotive electronics, providing the necessary processing power and control capabilities.It is important to note that the specific advantages and application scenarios may vary depending on the requirements, and it is recommended to refer to the datasheet and technical documentation provided by the manufacturer for detailed information about the MB89925PF-G-209-BND IC chip.