74ABT241CMTCX

74ABT241CMTCX

Manufacturer No:

74ABT241CMTCX

Manufacturer:

onsemi

Description:

IC BUF NON-INVERT 5.5V 20TSSOP

Datasheet:

Datasheet

Delivery:

Payment:

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74ABT241CMTCX Specifications

  • Type
    Parameter
  • Supplier Device Package
    20-TSSOP
  • Package / Case
    20-TSSOP (0.173", 4.40mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C (TA)
  • Voltage - Supply
    4.5V ~ 5.5V
  • Current - Output High, Low
    32mA, 64mA
  • Output Type
    3-State
  • Input Type
    -
  • Number of Bits per Element
    4
  • Number of Elements
    2
  • Logic Type
    Buffer, Non-Inverting
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Obsolete
  • Series
    74ABT
The SPC58EC80E3FMC0X integrated circuit chips offer several advantages and can be applied in various scenarios. Some of the advantages and application scenarios of these chips are:Advantages: 1. High Performance: The SPC58EC80E3FMC0X chips are based on the Power Architecture? technology and offer high processing power, making them suitable for demanding applications. 2. Safety and Security: These chips come with integrated safety and security features, including hardware security modules, secure boot, and cryptographic accelerators, ensuring the protection of sensitive data and preventing unauthorized access. 3. Connectivity: The chips support various communication interfaces such as Ethernet, CAN, LIN, and FlexRay, enabling seamless connectivity with other devices and systems. 4. Automotive-Grade: The SPC58EC80E3FMC0X chips are designed for automotive applications and comply with the industry's stringent requirements for reliability, temperature range, and quality standards. 5. Scalability: These chips offer scalability options, allowing developers to choose the appropriate variant based on their specific requirements, such as memory size, peripheral interfaces, and performance levels.Application Scenarios: 1. Automotive Control Systems: The SPC58EC80E3FMC0X chips are commonly used in automotive control systems, including engine management, transmission control, chassis control, and advanced driver-assistance systems (ADAS). 2. Infotainment Systems: These chips can be applied in infotainment systems, providing high-performance processing capabilities for multimedia playback, connectivity features, and user interface controls. 3. Industrial Automation: The SPC58EC80E3FMC0X chips are suitable for industrial automation applications, such as programmable logic controllers (PLCs), robotics, and machine vision systems, where high processing power and connectivity are required. 4. Medical Devices: These chips can be utilized in medical devices, including patient monitoring systems, diagnostic equipment, and medical imaging devices, where safety, security, and high-performance processing are critical. 5. Smart Grids: The SPC58EC80E3FMC0X chips can be used in smart grid applications, enabling secure communication, data processing, and control functions in energy management systems.Overall, the SPC58EC80E3FMC0X integrated circuit chips offer high performance, safety, security, connectivity, and scalability, making them suitable for a wide range of automotive, industrial, medical, and smart grid applications.