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74LVC3G34DC,125

74LVC3G34DC,125

Manufacturer No:

74LVC3G34DC,125

Manufacturer:

Nexperia USA Inc.

Description:

IC BUF NON-INVERT 5.5V 8VSSOP

Datasheet:

Datasheet

Delivery:

Payment:

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74LVC3G34DC,125 Specifications

  • Type
    Parameter
  • Supplier Device Package
    8-VSSOP
  • Package / Case
    8-VFSOP (0.091", 2.30mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 125°C (TA)
  • Voltage - Supply
    1.65V ~ 5.5V
  • Current - Output High, Low
    32mA, 32mA
  • Output Type
    Push-Pull
  • Input Type
    -
  • Number of Bits per Element
    1
  • Number of Elements
    3
  • Logic Type
    Buffer, Non-Inverting
  • Packaging
    Cut Tape (CT)
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Active
  • Series
    74LVC
The MB90548GPFR-G-192-BND integrated circuit chips have several advantages and application scenarios:Advantages: 1. High Performance: These chips are designed to deliver high performance with a 32-bit RISC CPU core running at a clock speed of up to 80 MHz. 2. Low Power Consumption: The chips are optimized for low power consumption, making them suitable for battery-powered devices and energy-efficient applications. 3. Rich Peripherals: They come with a wide range of peripherals, including UART, I2C, SPI, timers, PWM, ADC, and GPIO, providing flexibility for various applications. 4. Enhanced Security: The chips feature advanced security features like a hardware encryption engine, secure boot, and tamper detection, ensuring data integrity and protection against unauthorized access. 5. Robust Connectivity: They support various communication interfaces such as Ethernet, USB, CAN, and LIN, enabling seamless connectivity with other devices and networks.Application Scenarios: 1. Industrial Automation: The chips can be used in industrial automation systems for controlling and monitoring processes, thanks to their high performance, low power consumption, and robust connectivity options. 2. Automotive Electronics: With their enhanced security features and support for automotive communication protocols like CAN and LIN, these chips are suitable for applications in automotive electronics, such as body control modules, infotainment systems, and instrument clusters. 3. Smart Grids: The chips can be utilized in smart grid systems for monitoring and controlling power distribution, thanks to their low power consumption, communication interfaces, and security features. 4. Internet of Things (IoT): These chips are well-suited for IoT applications, where low power consumption, connectivity options, and security are crucial. They can be used in smart home devices, wearable technology, and other IoT-enabled devices. 5. Medical Devices: The chips can be employed in medical devices like patient monitoring systems, portable medical devices, and medical imaging equipment, leveraging their high performance, low power consumption, and security features.Overall, the MB90548GPFR-G-192-BND integrated circuit chips offer a combination of high performance, low power consumption, rich peripherals, enhanced security, and robust connectivity, making them suitable for a wide range of applications in various industries.
74LVC3G34DC,125 Relevant information