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74ABT2240CSCX

74ABT2240CSCX

Manufacturer No:

74ABT2240CSCX

Manufacturer:

onsemi

Description:

IC BUFFER INVERT 5.5V 20SOIC

Datasheet:

Datasheet

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74ABT2240CSCX Specifications

  • Type
    Parameter
  • Supplier Device Package
    20-SOIC
  • Package / Case
    20-SOIC (0.295", 7.50mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C (TA)
  • Voltage - Supply
    4.5V ~ 5.5V
  • Current - Output High, Low
    32mA, 15mA
  • Output Type
    3-State
  • Input Type
    -
  • Number of Bits per Element
    4
  • Number of Elements
    2
  • Logic Type
    Buffer, Inverting
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Obsolete
  • Series
    74ABT
The XE167H48F66LACFXQMA1 integrated circuit chips have several advantages and application scenarios:Advantages: 1. High Performance: The XE167H48F66LACFXQMA1 chips are based on the TriCore? architecture, which combines a 32-bit microcontroller core with a DSP (Digital Signal Processor) core. This allows for high-performance computing capabilities, making it suitable for demanding applications. 2. Integrated Peripherals: The chips come with a wide range of integrated peripherals, including CAN (Controller Area Network), LIN (Local Interconnect Network), SPI (Serial Peripheral Interface), UART (Universal Asynchronous Receiver-Transmitter), and more. This integration reduces the need for external components and simplifies the design process. 3. Enhanced Safety and Security: The XE167H48F66LACFXQMA1 chips feature enhanced safety and security features, such as memory protection units, watchdog timers, and hardware breakpoints. These features ensure reliable and secure operation in safety-critical applications. 4. Low Power Consumption: The chips are designed to operate at low power, making them suitable for battery-powered or energy-efficient applications. They incorporate power management features like power-down modes and clock gating to minimize power consumption.Application Scenarios: 1. Automotive Electronics: The XE167H48F66LACFXQMA1 chips are commonly used in automotive electronics applications, such as engine control units, transmission control units, body control modules, and advanced driver-assistance systems (ADAS). The high-performance computing capabilities and integrated peripherals make them suitable for these demanding applications. 2. Industrial Automation: The chips can be used in industrial automation systems, including programmable logic controllers (PLCs), motor control units, and robotics. The integrated peripherals, low power consumption, and safety features make them well-suited for these applications. 3. Smart Grids: The XE167H48F66LACFXQMA1 chips can be utilized in smart grid systems for monitoring and controlling power distribution. The high-performance computing capabilities and integrated communication interfaces (such as CAN and LIN) enable efficient data exchange and control in these systems. 4. Medical Devices: The chips can be employed in medical devices, such as patient monitoring systems, diagnostic equipment, and implantable devices. The combination of high-performance computing, low power consumption, and safety features makes them suitable for these critical applications.Overall, the XE167H48F66LACFXQMA1 integrated circuit chips offer high performance, integrated peripherals, enhanced safety and security, and low power consumption, making them suitable for a wide range of applications in automotive, industrial, smart grid, and medical domains.
74ABT2240CSCX Relevant information