74ACTQ18825MTDX

74ACTQ18825MTDX

Manufacturer No:

74ACTQ18825MTDX

Manufacturer:

onsemi

Description:

IC BUF NON-INVERT 5.5V 56TSSOP

Datasheet:

Datasheet

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74ACTQ18825MTDX Specifications

  • Type
    Parameter
  • Supplier Device Package
    56-TSSOP
  • Package / Case
    56-TFSOP (0.240", 6.10mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C (TA)
  • Voltage - Supply
    4.5V ~ 5.5V
  • Current - Output High, Low
    24mA, 24mA
  • Output Type
    3-State
  • Input Type
    -
  • Number of Bits per Element
    9
  • Number of Elements
    2
  • Logic Type
    Buffer, Non-Inverting
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Obsolete
  • Series
    74ACTQ
Advantages: 1. High-speed operation: The 74ACTQ18825MTDX integrated circuit chip operates at high speeds, which makes it suitable for applications with complex logic sequences.2. Low power consumption: The IC chips are designed to consume low power, making them a cost-effective solution for portable or battery-powered devices.3. Wide operating voltage range: The operating voltage range for 74ACTQ18825MTDX integrated circuit chips range from 2.0V to 6.0V, which makes them suitable for a wide range of applications.4. High noise immunity: The IC chips offer high noise immunity, which helps to prevent erroneous signals from affecting the functions of a circuit.Application scenarios: 1. Data processing: The 74ACTQ18825MTDX integrated circuit chip is commonly used in data processing applications where a fast and accurate processing of digital signals is required.2. Industrial automation: The IC chips can also be used in industrial automation for controlling machinery and equipment.3. Telecommunication: The 74ACTQ18825MTDX IC chips are used in telecommunication systems that require high-speed data transfer and processing.4. Consumer electronics: The IC chips are used in a wide range of consumer electronics such as smartphones, laptops, tablets, and gaming devices to provide high-performance processing capabilities.