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74ALVC162827TX Specifications
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TypeParameter
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Supplier Device Package56-TSSOP
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Package / Case56-TFSOP (0.240", 6.10mm Width)
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Mounting TypeSurface Mount
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Operating Temperature-40°C ~ 85°C (TA)
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Voltage - Supply1.65V ~ 3.6V
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Current - Output High, Low12mA, 12mA
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Output Type3-State
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Input Type-
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Number of Bits per Element10
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Number of Elements2
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Logic TypeBuffer, Non-Inverting
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PackagingTape & Reel (TR)
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Product StatusObsolete
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Series74ALVC
The MB90022PF-GS-365 is a specific model of an integrated circuit chip, and its advantages and application scenarios can vary depending on the specific features and capabilities of the chip. Unfortunately, without more information about the chip, it is not possible to provide accurate details about its advantages and application scenarios.However, in general, integrated circuit chips are widely used in various electronic devices and systems. They can be found in computers, smartphones, televisions, automotive systems, medical devices, and many other applications. Integrated circuit chips provide numerous advantages, such as:1. Miniaturization: Integrated circuits allow for the miniaturization of electronic components, enabling the development of smaller and more compact devices.2. Cost-effectiveness: Integrated circuits can be mass-produced, leading to cost savings in manufacturing and assembly processes.3. Power efficiency: Integrated circuits are designed to be power-efficient, helping to extend the battery life of portable devices and reduce energy consumption in general.4. Reliability: Integrated circuits are highly reliable due to their compact design and reduced number of interconnections, minimizing the risk of failures.5. Performance: Integrated circuits can offer high-speed processing capabilities, enabling faster and more efficient operation of electronic devices.In summary, the advantages and application scenarios of the MB90022PF-GS-365 integrated circuit chip would depend on its specific features and capabilities, which would need to be provided for a more accurate assessment.
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