74LCXZ16244MTD

74LCXZ16244MTD

Manufacturer No:

74LCXZ16244MTD

Manufacturer:

onsemi

Description:

IC BUF NON-INVERT 3.6V 48TSSOP

Datasheet:

Datasheet

Delivery:

Payment:

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74LCXZ16244MTD Specifications

  • Type
    Parameter
  • Supplier Device Package
    48-TSSOP
  • Package / Case
    48-TFSOP (0.240", 6.10mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C (TA)
  • Voltage - Supply
    2.7V ~ 3.6V
  • Current - Output High, Low
    24mA, 24mA
  • Output Type
    3-State
  • Input Type
    -
  • Number of Bits per Element
    4
  • Number of Elements
    4
  • Logic Type
    Buffer, Non-Inverting
  • Packaging
    Tube
  • Product Status
    Obsolete
  • Series
    74LCXZ
The MB89697BPFM-G-233-BND is a specific model of integrated circuit chip manufactured by Fujitsu. While specific advantages and application scenarios may vary depending on the specific requirements and use cases, here are some general advantages and potential application scenarios for this chip:Advantages: 1. High Performance: The MB89697BPFM-G-233-BND chip is designed to deliver high performance with a fast processing speed, making it suitable for applications that require quick data processing and response times. 2. Low Power Consumption: This chip is designed to operate with low power consumption, making it suitable for battery-powered devices or applications where energy efficiency is crucial. 3. Integrated Peripherals: The chip comes with various integrated peripherals such as UART, I2C, SPI, timers, and PWM, which can simplify the design process and reduce the need for additional external components. 4. Wide Operating Temperature Range: The chip is designed to operate reliably across a wide temperature range, making it suitable for applications that require operation in extreme environments.Application Scenarios: 1. Industrial Automation: The high performance and integrated peripherals of the MB89697BPFM-G-233-BND chip make it suitable for various industrial automation applications such as motor control, robotics, and process control systems. 2. Internet of Things (IoT): The low power consumption and integrated peripherals make this chip suitable for IoT applications such as smart home devices, wearable devices, and sensor nodes. 3. Automotive Electronics: The wide operating temperature range and high performance make this chip suitable for automotive applications such as engine control units, dashboard systems, and advanced driver-assistance systems (ADAS). 4. Consumer Electronics: The chip can be used in various consumer electronics applications such as home appliances, gaming consoles, and multimedia devices, where a balance of performance and power efficiency is required.It's important to note that the specific advantages and application scenarios may vary depending on the requirements and specifications of the project. It is recommended to refer to the datasheet and consult with the manufacturer for detailed information and suitability for a specific application.