74VCX1632245LB
Manufacturer No:
74VCX1632245LB
Manufacturer:
Description:
IC TRANSCEIVER 54TFBGA
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74VCX1632245LB Specifications
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TypeParameter
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Supplier Device Package54-TFBGA (8x5.5)
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Package / Case54-TFBGA
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Mounting TypeSurface Mount
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Operating Temperature-40°C ~ 85°C (TA)
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Voltage - Supply1.65V ~ 2.7V, 2.3V ~ 3.6V
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Current - Output High, Low8mA, 8mA; 18mA, 18mA
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Output Type3-State
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Input Type-
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Number of Bits per Element8
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Number of Elements2
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Logic TypeTranslation Transceiver
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PackagingTray
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Product StatusObsolete
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Series74VCX
The 74VCX1632245LB is a specific type of integrated circuit chip that belongs to the 74VCX series. It is a 16-bit bus transceiver with 3-state outputs. Here are some advantages and application scenarios of this chip:Advantages: 1. High-speed operation: The 74VCX1632245LB chip operates at high speeds, making it suitable for applications that require fast data transfer. 2. Low power consumption: This chip is designed to consume low power, making it energy-efficient and suitable for battery-powered devices. 3. 3-state outputs: The 74VCX1632245LB chip has 3-state outputs, which means it can be effectively used in bus-oriented systems where multiple devices share a common bus. 4. Wide operating voltage range: This chip can operate within a wide voltage range, making it compatible with various power supply levels.Application scenarios: 1. Data communication systems: The 74VCX1632245LB chip can be used in data communication systems to enable bidirectional data transfer between different devices or modules. 2. Microprocessor interfacing: It can be used to interface microprocessors or microcontrollers with external devices, such as memory modules or peripheral devices. 3. Bus-based systems: This chip is suitable for bus-based systems, where multiple devices need to share a common data bus. It allows for efficient data transfer and control between devices. 4. Industrial automation: The 74VCX1632245LB chip can be used in industrial automation systems, where it can facilitate communication between various control modules and sensors.It is important to note that the specific application scenarios may vary depending on the requirements of the system and the compatibility of the chip with other components.
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