CD74HC366M96

CD74HC366M96

Manufacturer No:

CD74HC366M96

Manufacturer:

Texas Instruments

Description:

IC BUFFER INVERT 6V 16SOIC

Datasheet:

Datasheet

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CD74HC366M96 Specifications

  • Type
    Parameter
  • Supplier Device Package
    16-SOIC
  • Package / Case
    16-SOIC (0.154", 3.90mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -55°C ~ 125°C (TA)
  • Voltage - Supply
    2V ~ 6V
  • Current - Output High, Low
    7.8mA, 7.8mA
  • Output Type
    3-State
  • Input Type
    -
  • Number of Bits per Element
    6
  • Number of Elements
    1
  • Logic Type
    Buffer, Inverting
  • Packaging
    Cut Tape (CT)
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Active
  • Series
    74HC
The DSPIC33EP256MC502-I/SP integrated circuit chips have several advantages and application scenarios:Advantages: 1. High Performance: These chips are based on the dsPIC33E core, which offers high performance and efficient execution of complex algorithms. 2. Enhanced Connectivity: They feature multiple communication interfaces such as UART, SPI, I2C, and CAN, enabling seamless connectivity with other devices. 3. Rich Peripherals: The chips come with a wide range of peripherals including timers, PWM modules, ADCs, and DACs, allowing for versatile applications. 4. Low Power Consumption: They are designed to operate at low power, making them suitable for battery-powered applications. 5. Robustness: These chips are built to withstand harsh environments and have enhanced ESD protection, making them reliable for industrial applications.Application Scenarios: 1. Motor Control: The DSPIC33EP256MC502-I/SP chips are commonly used in motor control applications such as industrial automation, robotics, and electric vehicles. Their high-performance core and rich peripherals enable precise control of motors. 2. Power Electronics: These chips are suitable for power electronics applications like inverters, power supplies, and UPS systems. The integrated peripherals and communication interfaces facilitate efficient power management and control. 3. Communication Systems: With their enhanced connectivity options, these chips can be used in communication systems such as wireless sensor networks, IoT devices, and data loggers. They can interface with various communication protocols and enable data transmission and processing. 4. Medical Devices: The low power consumption and robustness of these chips make them suitable for medical devices like patient monitoring systems, portable medical equipment, and implantable devices. 5. Automotive Electronics: The DSPIC33EP256MC502-I/SP chips find applications in automotive electronics, including engine control units, dashboard systems, and advanced driver-assistance systems (ADAS). Their high performance and connectivity options enable efficient control and communication in vehicles.Overall, the DSPIC33EP256MC502-I/SP integrated circuit chips offer high performance, connectivity, and versatility, making them suitable for a wide range of applications in various industries.