SN74AUP1G126DPWR

SN74AUP1G126DPWR

Manufacturer No:

SN74AUP1G126DPWR

Manufacturer:

Texas Instruments

Description:

IC BUF NON-INVERT 3.6V 5X2SON

Datasheet:

Datasheet

Delivery:

Payment:

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SN74AUP1G126DPWR Specifications

  • Type
    Parameter
  • Supplier Device Package
    5-X2SON (0.8x0.8)
  • Package / Case
    4-XFDFN Exposed Pad
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C (TA)
  • Voltage - Supply
    0.8V ~ 3.6V
  • Current - Output High, Low
    4mA, 4mA
  • Output Type
    3-State
  • Input Type
    -
  • Number of Bits per Element
    1
  • Number of Elements
    1
  • Logic Type
    Buffer, Non-Inverting
  • Packaging
    Cut Tape (CT)
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Active
  • Series
    74AUP
The R5F572NNHDFB#10 is a specific model of integrated circuit chip developed by Renesas Electronics Corporation. While specific advantages and application scenarios may vary depending on the requirements and use cases, here are some general advantages and potential application scenarios for this chip:Advantages: 1. High-performance: The R5F572NNHDFB#10 chip is designed to deliver high-performance computing capabilities, making it suitable for applications that require fast and efficient processing. 2. Low power consumption: This chip is optimized for low power consumption, making it ideal for battery-powered devices or applications where energy efficiency is crucial. 3. Small form factor: The compact size of the chip allows for easy integration into various devices, making it suitable for space-constrained applications. 4. Rich peripheral set: The chip offers a wide range of built-in peripherals, such as timers, UART, I2C, SPI, ADC, etc., enabling seamless connectivity and interaction with external devices. 5. Enhanced security features: The R5F572NNHDFB#10 chip incorporates security features like encryption and tamper detection, making it suitable for applications that require data protection.Application scenarios: 1. Internet of Things (IoT) devices: The low power consumption and small form factor of the chip make it suitable for IoT devices, such as smart home devices, wearables, or industrial sensors. 2. Consumer electronics: The high-performance computing capabilities of the chip make it suitable for consumer electronics applications like smartphones, tablets, or gaming consoles. 3. Industrial automation: The chip's rich peripheral set and enhanced security features make it suitable for industrial automation applications, such as programmable logic controllers (PLCs), motor control systems, or robotics. 4. Automotive systems: The chip's high-performance computing capabilities and security features make it suitable for automotive applications, such as engine control units (ECUs), advanced driver-assistance systems (ADAS), or infotainment systems. 5. Medical devices: The chip's low power consumption and small form factor make it suitable for medical devices, such as portable medical monitors, implantable devices, or diagnostic equipment.It's important to note that the specific advantages and application scenarios may vary depending on the requirements and specifications of the project. It is recommended to consult the datasheet and technical documentation provided by the manufacturer for detailed information on the capabilities and recommended applications of the R5F572NNHDFB#10 chip.