SN74ACT244N

SN74ACT244N

Manufacturer No:

SN74ACT244N

Manufacturer:

Texas Instruments

Description:

IC BUF NON-INVERT 5.5V 20DIP

Datasheet:

Datasheet

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SN74ACT244N Specifications

  • Type
    Parameter
  • Supplier Device Package
    20-PDIP
  • Package / Case
    20-DIP (0.300", 7.62mm)
  • Mounting Type
    Through Hole
  • Operating Temperature
    -40°C ~ 85°C (TA)
  • Voltage - Supply
    4.5V ~ 5.5V
  • Current - Output High, Low
    24mA, 24mA
  • Output Type
    3-State
  • Input Type
    -
  • Number of Bits per Element
    4
  • Number of Elements
    2
  • Logic Type
    Buffer, Non-Inverting
  • Packaging
    Tube
  • Packaging
    Bulk
  • Product Status
    Active
  • Series
    74ACT
The XE164F96F66LACFXUMA1 integrated circuit chips have several advantages and application scenarios:Advantages: 1. High Performance: These chips are based on the XE166 architecture, which offers high processing power and performance. 2. Integrated Peripherals: They come with a wide range of integrated peripherals such as UART, SPI, I2C, CAN, ADC, PWM, and timers, which simplifies the design process and reduces the need for external components. 3. Low Power Consumption: The chips are designed to operate at low power, making them suitable for battery-powered applications. 4. Robust Communication: They support various communication protocols like CAN, LIN, and UART, enabling seamless connectivity with other devices. 5. Enhanced Security: These chips come with built-in security features like memory protection unit (MPU) and hardware encryption, ensuring data integrity and protection against unauthorized access.Application Scenarios: 1. Industrial Automation: The XE164F96F66LACFXUMA1 chips are commonly used in industrial automation systems for controlling and monitoring processes. Their high performance and integrated peripherals make them suitable for applications like motor control, PLCs, and robotics. 2. Automotive Electronics: These chips find applications in automotive electronics, especially in areas like engine control units (ECUs), body control modules (BCMs), and infotainment systems. The robust communication capabilities and security features make them ideal for automotive applications. 3. Smart Grids: The chips can be used in smart grid systems for monitoring and controlling power distribution. Their low power consumption and communication capabilities enable efficient energy management and grid optimization. 4. Home Automation: With their integrated peripherals and low power consumption, these chips can be used in home automation systems for controlling lighting, HVAC, security systems, and other smart home devices. 5. Medical Devices: The XE164F96F66LACFXUMA1 chips can be utilized in medical devices like patient monitoring systems, infusion pumps, and diagnostic equipment. Their high performance and security features ensure reliable and accurate operation.Overall, the XE164F96F66LACFXUMA1 integrated circuit chips offer high performance, integrated peripherals, low power consumption, and security features, making them suitable for a wide range of applications in various industries.