CD74HC4050M

CD74HC4050M

Manufacturer No:

CD74HC4050M

Manufacturer:

Texas Instruments

Description:

IC BUFFER NON-INVERT 6V 16SOIC

Datasheet:

Datasheet

Delivery:

Payment:

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CD74HC4050M Specifications

  • Type
    Parameter
  • Supplier Device Package
    16-SOIC
  • Package / Case
    16-SOIC (0.154", 3.90mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -55°C ~ 125°C (TA)
  • Voltage - Supply
    2V ~ 6V
  • Current - Output High, Low
    5.2mA, 5.2mA
  • Output Type
    Push-Pull
  • Input Type
    -
  • Number of Bits per Element
    1
  • Number of Elements
    6
  • Logic Type
    Buffer, Non-Inverting
  • Packaging
    Tube
  • Product Status
    Last Time Buy
  • Series
    74HC
The MB9BF429SAPMC-GK7E2 is a specific model of integrated circuit chip manufactured by Fujitsu. While specific advantages and application scenarios may vary depending on the requirements of a particular project, here are some general advantages and application scenarios of this chip:Advantages: 1. High-performance: The MB9BF429SAPMC-GK7E2 chip is designed to deliver high-performance processing capabilities, making it suitable for demanding applications. 2. Low power consumption: It is designed to be energy-efficient, which is beneficial for battery-powered devices or applications where power consumption is a concern. 3. Integrated peripherals: The chip comes with various integrated peripherals such as UART, I2C, SPI, timers, and GPIOs, reducing the need for external components and simplifying the design process. 4. Rich memory options: It offers a range of memory options, including Flash memory and SRAM, allowing for flexible storage and data handling capabilities. 5. Robust connectivity: The chip supports various communication interfaces like USB, CAN, and Ethernet, enabling seamless connectivity with other devices or networks.Application Scenarios: 1. Industrial automation: The MB9BF429SAPMC-GK7E2 chip can be used in industrial automation systems for controlling and monitoring processes, thanks to its high-performance processing capabilities and integrated peripherals. 2. Internet of Things (IoT): With its low power consumption and connectivity options, this chip can be utilized in IoT devices such as smart home appliances, wearables, or environmental sensors. 3. Automotive electronics: The chip's robust connectivity features and high-performance processing make it suitable for automotive applications like advanced driver-assistance systems (ADAS), infotainment systems, or engine control units (ECUs). 4. Consumer electronics: It can be used in various consumer electronic devices such as smart TVs, gaming consoles, or home automation systems, where its processing power and integrated peripherals can enhance functionality. 5. Medical devices: The chip's low power consumption, connectivity options, and processing capabilities make it suitable for medical devices like patient monitoring systems, portable diagnostic devices, or medical imaging equipment.It's important to note that the specific advantages and application scenarios may vary depending on the requirements and specifications of a particular project.