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CLVC1G125IDCKREP

CLVC1G125IDCKREP

Manufacturer No:

CLVC1G125IDCKREP

Manufacturer:

Texas Instruments

Description:

IC BUF NON-INVERT 5.5V SC70-5

Datasheet:

Datasheet

Delivery:

Payment:

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CLVC1G125IDCKREP Specifications

  • Type
    Parameter
  • Supplier Device Package
    SC-70-5
  • Package / Case
    5-TSSOP, SC-70-5, SOT-353
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C (TA)
  • Voltage - Supply
    1.65V ~ 5.5V
  • Current - Output High, Low
    32mA, 32mA
  • Output Type
    3-State
  • Input Type
    -
  • Number of Bits per Element
    1
  • Number of Elements
    1
  • Logic Type
    Buffer, Non-Inverting
  • Packaging
    Cut Tape (CT)
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Active
  • Series
    74LVC
The EFM32WG890F256-B-BGA112R is a specific model of integrated circuit (IC) chip from the EFM32 Wonder Gecko family, developed by Silicon Labs. This IC chip offers several advantages and can be applied in various scenarios. Some of the advantages and application scenarios of the EFM32WG890F256-B-BGA112R IC chip are:Advantages: 1. Low Power Consumption: The EFM32 Wonder Gecko family is known for its low power consumption, making it suitable for battery-powered devices and energy-efficient applications. 2. High Performance: Despite its low power consumption, the EFM32WG890F256-B-BGA112R chip offers high-performance capabilities, enabling it to handle complex tasks and applications. 3. Integrated Peripherals: The chip comes with a wide range of integrated peripherals, such as UART, SPI, I2C, USB, ADC, DAC, timers, and more. This integration reduces the need for external components and simplifies the design process. 4. Security Features: The EFM32WG890F256-B-BGA112R chip includes security features like a hardware cryptographic accelerator, true random number generator (TRNG), and secure bootloading, making it suitable for applications that require data protection and secure communication.Application Scenarios: 1. Internet of Things (IoT): The low power consumption and integrated peripherals of the EFM32WG890F256-B-BGA112R chip make it ideal for IoT applications. It can be used in smart home devices, wearables, environmental monitoring systems, and more. 2. Industrial Automation: The high-performance capabilities and integrated peripherals of the chip make it suitable for industrial automation applications. It can be used in motor control systems, PLCs (Programmable Logic Controllers), and industrial communication protocols. 3. Consumer Electronics: The EFM32WG890F256-B-BGA112R chip can be applied in various consumer electronics devices, such as smartwatches, fitness trackers, remote controls, and home automation systems. 4. Medical Devices: The low power consumption and security features of the chip make it suitable for medical devices. It can be used in portable medical devices, patient monitoring systems, and medical data encryption. 5. Energy Management: The EFM32WG890F256-B-BGA112R chip's low power consumption and integrated peripherals can be utilized in energy management systems, smart meters, and energy-efficient appliances.These are just a few examples of the advantages and application scenarios of the EFM32WG890F256-B-BGA112R IC chip. Its versatility, low power consumption, high performance, and integrated peripherals make it suitable for a wide range of applications in various industries.
CLVC1G125IDCKREP Relevant information