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SN74LVC1G126DCKT

SN74LVC1G126DCKT

Manufacturer No:

SN74LVC1G126DCKT

Manufacturer:

Texas Instruments

Description:

IC BUF NON-INVERT 5.5V SC70-5

Datasheet:

Datasheet

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Payment:

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SN74LVC1G126DCKT Specifications

  • Type
    Parameter
  • Supplier Device Package
    SC-70-5
  • Package / Case
    5-TSSOP, SC-70-5, SOT-353
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 125°C (TA)
  • Voltage - Supply
    1.65V ~ 5.5V
  • Current - Output High, Low
    32mA, 32mA
  • Output Type
    3-State
  • Input Type
    -
  • Number of Bits per Element
    1
  • Number of Elements
    1
  • Logic Type
    Buffer, Non-Inverting
  • Packaging
    Cut Tape (CT)
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Active
  • Series
    74LVC
The DSPIC33CK256MP506-E/MR integrated circuit chips offer several advantages and can be applied in various scenarios. Some of the advantages and application scenarios are:Advantages: 1. High Performance: The DSPIC33CK256MP506-E/MR chips are based on the dsPIC33C core, which provides high performance and processing power for demanding applications. 2. Digital Signal Processing (DSP) Capabilities: These chips have built-in DSP instructions and peripherals, making them suitable for applications that require real-time signal processing, such as audio processing, motor control, and power conversion. 3. Integrated Peripherals: The chips come with a wide range of integrated peripherals, including analog-to-digital converters (ADCs), digital-to-analog converters (DACs), timers, communication interfaces (UART, SPI, I2C), and more. This integration reduces the need for external components and simplifies the design process. 4. Low Power Consumption: The DSPIC33CK256MP506-E/MR chips are designed to operate at low power, making them suitable for battery-powered applications or devices that require energy efficiency. 5. Robustness and Reliability: These chips are designed to operate in harsh environments and can withstand high temperatures, voltage fluctuations, and electromagnetic interference.Application Scenarios: 1. Motor Control: The DSPIC33CK256MP506-E/MR chips are commonly used in motor control applications, such as industrial automation, robotics, and electric vehicles. The integrated peripherals and DSP capabilities enable precise control of motor speed, torque, and position. 2. Power Conversion: These chips can be used in power conversion applications, such as inverters, converters, and power supplies. The DSP capabilities allow for efficient and accurate control of power conversion processes. 3. Audio Processing: The DSPIC33CK256MP506-E/MR chips can be used in audio processing applications, such as audio amplifiers, audio effects processors, and digital audio workstations. The integrated DSP instructions and peripherals enable real-time audio signal processing and manipulation. 4. Industrial Control Systems: These chips are suitable for various industrial control systems, including process control, monitoring, and data acquisition. The high performance and integrated peripherals make them ideal for real-time control and data processing in industrial environments. 5. Internet of Things (IoT): The low power consumption and integrated peripherals of these chips make them suitable for IoT applications, such as smart home devices, wearable devices, and sensor nodes. They can perform data processing and communication tasks efficiently while conserving energy.Overall, the DSPIC33CK256MP506-E/MR integrated circuit chips offer high performance, DSP capabilities, integrated peripherals, low power consumption, and robustness, making them versatile for a wide range of applications in various industries.
SN74LVC1G126DCKT Relevant information