SN74LVC1G126DBVT

SN74LVC1G126DBVT

Manufacturer No:

SN74LVC1G126DBVT

Manufacturer:

Texas Instruments

Description:

IC BUF NON-INVERT 5.5V SOT23-5

Datasheet:

Datasheet

Delivery:

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SN74LVC1G126DBVT Specifications

  • Type
    Parameter
  • Supplier Device Package
    SOT-23-5
  • Package / Case
    SC-74A, SOT-753
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 125°C (TA)
  • Voltage - Supply
    1.65V ~ 5.5V
  • Current - Output High, Low
    32mA, 32mA
  • Output Type
    3-State
  • Input Type
    -
  • Number of Bits per Element
    1
  • Number of Elements
    1
  • Logic Type
    Buffer, Non-Inverting
  • Packaging
    Cut Tape (CT)
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Active
  • Series
    74LVC
The DSPIC33EP128GS708-E/PT integrated circuit chip offers several advantages and can be applied in various scenarios:1. High performance: The chip is based on the dsPIC33EP core and operates at a high-speed clock frequency of up to 70 MIPS (Million Instructions per Second), providing fast and efficient processing capability.2. Digital signal processing (DSP) capabilities: The chip is designed specifically for DSP applications and comes with a wide range of integrated peripherals such as a high-resolution ADC (Analog-to-Digital Converter), DAC (Digital-to-Analog Converter), PWM (Pulse Width Modulation) modules, and more.3. Enhanced connectivity: The chip features multiple communication interfaces including UART, SPI, I2C, CAN, USB, and Ethernet. This makes it suitable for applications that require connectivity with other devices or networks.4. Extended memory: The DSPIC33EP128GS708-E/PT offers up to 128 KB of Flash program memory, which allows for complex code implementation and data storage. It also provides up to 16 KB of RAM for efficient data processing.5. High integration: The chip includes a variety of on-chip resources like timers, comparators, interrupts, and digital I/O, enabling the integration of multiple functions into a single chip. This can help reduce component count, save board space, and simplify system design.Application scenarios:1. Motor control: With its high-performance DSP capabilities and PWM modules, the chip is well-suited for motor control applications. It can control brushless DC motors, AC motors, and other types of motors with precision and efficiency.2. Industrial automation: The chip's extensive communication interfaces, fast processing speed, and high integration make it ideal for controlling and monitoring industrial automation systems. It can handle tasks such as data acquisition, process control, and communication with other devices.3. Power electronics: The chip's built-in ADCs and PWM modules make it suitable for applications in power electronics, such as power inverters, power supplies, and energy management systems. It can efficiently regulate power conversion and ensure accurate control.4. Automotive systems: The chip's robust communication interfaces, high performance, and integrated peripherals make it applicable in automotive applications, including engine control, advanced driver assistance systems (ADAS), and infotainment systems.5. Digital audio processing: The chip's DSP capabilities and integrated DACs facilitate digital audio processing applications, such as audio effects, audio synthesis, and audio filtering. It can provide high-quality audio output with low latency and minimal distortion.