SN74LV244APWRG3

SN74LV244APWRG3

Manufacturer No:

SN74LV244APWRG3

Manufacturer:

Texas Instruments

Description:

IC BUF NON-INVERT 5.5V 20TSSOP

Datasheet:

Datasheet

Delivery:

Payment:

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SN74LV244APWRG3 Specifications

  • Type
    Parameter
  • Supplier Device Package
    20-TSSOP
  • Package / Case
    20-TSSOP (0.173", 4.40mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 125°C (TA)
  • Voltage - Supply
    2V ~ 5.5V
  • Current - Output High, Low
    16mA, 16mA
  • Output Type
    3-State
  • Input Type
    -
  • Number of Bits per Element
    4
  • Number of Elements
    2
  • Logic Type
    Buffer, Non-Inverting
  • Packaging
    Cut Tape (CT)
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Active
  • Series
    74LV
The MB89925PF-G-208-BND is a specific model of integrated circuit chip manufactured by Fujitsu. While specific advantages and application scenarios may vary depending on the specific requirements and use cases, here are some general advantages and potential application scenarios for this chip:Advantages: 1. High Performance: The MB89925PF-G-208-BND chip is designed to deliver high performance and efficiency, making it suitable for demanding applications. 2. Low Power Consumption: It is designed to operate with low power consumption, making it suitable for battery-powered devices or energy-efficient applications. 3. Integrated Features: The chip integrates various features and peripherals, reducing the need for external components and simplifying the overall system design. 4. Small Form Factor: The chip comes in a compact package, making it suitable for space-constrained applications or devices. 5. Cost-Effective: The chip offers a balance between performance and cost, making it an economical choice for various applications.Application Scenarios: 1. Industrial Automation: The MB89925PF-G-208-BND chip can be used in industrial automation systems for controlling and monitoring various processes, such as motor control, sensor interfacing, and communication. 2. Consumer Electronics: It can be used in consumer electronic devices like smart home appliances, wearable devices, or IoT devices, where low power consumption and integration of features are crucial. 3. Automotive Electronics: The chip can find applications in automotive electronics, such as engine control units, dashboard systems, or advanced driver-assistance systems (ADAS). 4. Medical Devices: It can be used in medical devices like patient monitoring systems, portable medical equipment, or diagnostic devices, where high performance and low power consumption are essential. 5. Communication Systems: The chip can be utilized in communication systems, such as routers, switches, or network equipment, where it can handle data processing, interface with various communication protocols, and manage network connectivity.It is important to note that the specific advantages and application scenarios may vary depending on the requirements and specifications of the project or system in which the chip is being used.