MC74HCT125ADTR2G

MC74HCT125ADTR2G

Manufacturer No:

MC74HCT125ADTR2G

Manufacturer:

onsemi

Description:

IC BUFFER NON-INVERT 6V 14TSSOP

Datasheet:

Datasheet

Delivery:

Payment:

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MC74HCT125ADTR2G Specifications

  • Type
    Parameter
  • Supplier Device Package
    14-TSSOP
  • Package / Case
    14-TSSOP (0.173", 4.40mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -55°C ~ 125°C (TA)
  • Voltage - Supply
    2V ~ 6V
  • Current - Output High, Low
    6mA, 6mA
  • Output Type
    3-State
  • Input Type
    -
  • Number of Bits per Element
    1
  • Number of Elements
    4
  • Logic Type
    Buffer, Non-Inverting
  • Packaging
    Cut Tape (CT)
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Active
  • Series
    74HCT
The MB89698BPFM-G-272 is a specific model of integrated circuit chip manufactured by Fujitsu. While specific advantages and application scenarios may vary depending on the requirements and use cases, here are some general advantages and potential application scenarios for this chip:Advantages: 1. High Performance: The MB89698BPFM-G-272 chip is designed to deliver high performance with a powerful CPU core and various integrated peripherals. 2. Low Power Consumption: It is optimized for low power consumption, making it suitable for battery-powered devices or applications where energy efficiency is crucial. 3. Integrated Peripherals: The chip comes with various integrated peripherals such as UART, I2C, SPI, timers, and ADC, reducing the need for external components and simplifying the overall system design. 4. Wide Operating Temperature Range: It can operate reliably in a wide temperature range, making it suitable for applications in harsh environments. 5. Small Form Factor: The chip is available in a compact package, enabling it to be used in space-constrained applications.Application Scenarios: 1. Industrial Automation: The MB89698BPFM-G-272 chip can be used in industrial automation systems for controlling and monitoring various processes. Its high performance and integrated peripherals make it suitable for applications such as motor control, sensor interfacing, and data acquisition. 2. Internet of Things (IoT): With its low power consumption and integrated peripherals, this chip can be used in IoT devices for connectivity, data processing, and control. It can be employed in applications like smart home automation, environmental monitoring, or asset tracking. 3. Consumer Electronics: The chip's high performance and small form factor make it suitable for various consumer electronics applications. It can be used in devices like smart appliances, wearable devices, or gaming peripherals. 4. Automotive Electronics: The wide operating temperature range and integrated peripherals of this chip make it suitable for automotive applications. It can be used in systems like engine control units, dashboard displays, or advanced driver-assistance systems (ADAS). 5. Medical Devices: The chip's low power consumption and integrated peripherals can be utilized in medical devices such as patient monitoring systems, portable diagnostic devices, or drug delivery systems.It is important to note that the specific advantages and application scenarios may vary depending on the requirements and specifications of the project. It is recommended to refer to the manufacturer's documentation and consult with experts for detailed information and suitability for a specific application.