74HCT244PW,118

74HCT244PW,118

Manufacturer No:

74HCT244PW,118

Manufacturer:

Nexperia USA Inc.

Description:

IC BUF NON-INVERT 5.5V 20TSSOP

Datasheet:

Datasheet

Delivery:

Payment:

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74HCT244PW,118 Specifications

  • Type
    Parameter
  • Supplier Device Package
    20-TSSOP
  • Package / Case
    20-TSSOP (0.173", 4.40mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 125°C (TA)
  • Voltage - Supply
    4.5V ~ 5.5V
  • Current - Output High, Low
    6mA, 6mA
  • Output Type
    3-State
  • Input Type
    -
  • Number of Bits per Element
    4
  • Number of Elements
    2
  • Logic Type
    Buffer, Non-Inverting
  • Packaging
    Cut Tape (CT)
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Active
  • Series
    74HCT
The SPC560P50L5CEFAY integrated circuit chips have several advantages and application scenarios:Advantages: 1. High Performance: The SPC560P50L5CEFAY chips are based on the Power Architecture? technology, which provides high processing power and performance. 2. Enhanced Security: These chips come with advanced security features like secure boot, secure firmware update, and cryptographic acceleration, ensuring the safety of the system. 3. Connectivity: The chips support various communication interfaces like CAN, LIN, FlexRay, and Ethernet, enabling seamless connectivity with other devices. 4. Automotive Grade: The SPC560P50L5CEFAY chips are designed specifically for automotive applications, meeting the stringent requirements of the automotive industry. 5. Low Power Consumption: These chips are optimized for low power consumption, making them suitable for battery-powered applications.Application Scenarios: 1. Automotive Control Systems: The SPC560P50L5CEFAY chips are commonly used in automotive control systems like engine management, transmission control, and chassis control. 2. Advanced Driver Assistance Systems (ADAS): These chips can be used in ADAS applications like adaptive cruise control, lane departure warning, and collision avoidance systems. 3. Infotainment Systems: The SPC560P50L5CEFAY chips can be utilized in infotainment systems to provide multimedia capabilities, connectivity, and user interface functionalities. 4. Body Electronics: These chips can be employed in various body electronics applications like central locking, power windows, and climate control systems. 5. Industrial Control Systems: The high performance and connectivity features of these chips make them suitable for industrial control systems like factory automation and robotics.Overall, the SPC560P50L5CEFAY integrated circuit chips offer high performance, enhanced security, and connectivity, making them ideal for automotive and industrial applications.