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74LVC2G126DP,125

74LVC2G126DP,125

Manufacturer No:

74LVC2G126DP,125

Manufacturer:

Nexperia USA Inc.

Description:

IC BUF NON-INVERT 5.5V 8TSSOP

Datasheet:

Datasheet

Delivery:

Payment:

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74LVC2G126DP,125 Specifications

  • Type
    Parameter
  • Supplier Device Package
    8-TSSOP
  • Package / Case
    8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 125°C (TA)
  • Voltage - Supply
    1.65V ~ 5.5V
  • Current - Output High, Low
    32mA, 32mA
  • Output Type
    3-State
  • Input Type
    -
  • Number of Bits per Element
    1
  • Number of Elements
    2
  • Logic Type
    Buffer, Non-Inverting
  • Packaging
    Cut Tape (CT)
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Active
  • Series
    74LVC
The SPC570S50E1CEFAR integrated circuit chips have several advantages and application scenarios:Advantages: 1. High Performance: The SPC570S50E1CEFAR chips are based on the Power Architecture? technology and offer high processing power, making them suitable for demanding applications. 2. Safety and Security: These chips are designed with safety and security features, including hardware security modules, memory protection units, and error correction codes, ensuring the integrity and reliability of the system. 3. Connectivity: The chips support various communication interfaces like CAN, LIN, FlexRay, Ethernet, and USB, enabling seamless connectivity with other devices and networks. 4. Automotive Grade: The SPC570S50E1CEFAR chips are specifically designed for automotive applications, meeting the stringent requirements of the automotive industry, such as temperature range, reliability, and safety standards. 5. Integrated Peripherals: These chips come with a wide range of integrated peripherals like ADCs, timers, PWMs, and communication interfaces, reducing the need for external components and simplifying the overall system design.Application Scenarios: 1. Automotive Control Systems: The SPC570S50E1CEFAR chips are commonly used in automotive control systems, such as engine management, transmission control, chassis control, and advanced driver-assistance systems (ADAS). 2. Industrial Automation: These chips can be utilized in industrial automation applications, including robotics, motion control, and machine vision systems, where high processing power and connectivity are required. 3. Smart Grids: The SPC570S50E1CEFAR chips can be employed in smart grid systems for monitoring and controlling power distribution, ensuring efficient energy management and grid stability. 4. Medical Devices: These chips can be used in medical devices like patient monitoring systems, diagnostic equipment, and medical imaging devices, where safety, reliability, and high-performance processing are crucial. 5. Aerospace and Defense: The SPC570S50E1CEFAR chips find applications in aerospace and defense systems, such as avionics, flight control systems, and military-grade communication systems, where reliability and security are paramount.Overall, the SPC570S50E1CEFAR integrated circuit chips offer high performance, safety, connectivity, and are specifically designed for automotive and other demanding applications.
74LVC2G126DP,125 Relevant information